Coper Failis becoming increasingly important in chip packaging due to its electrical conductivity, thermal conductivity, processability, and cost-effectiveness. Eia kahi kiko'ī kiko'ī o kāna mau noi kiko'ī ma nā kāpili chip
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- ʻO ka hoʻololiʻana no ke kīwī gula a me keʻano aluminum
- : Copper wire bonding offers lower resistance and better thermal conductivity in high-frequency and high-current applications, effectively reducing power loss in chip interconnections and improving overall electrical performance. No laila, e hoʻohana ana i ka copper copper he mea hana ma keʻano o nā kaʻina hana e hoʻonui ai i nā hana a me ke hilinaʻiʻole i ka hoʻonuiʻana i nā uku.
- Hoʻohanaʻia ma nā electrodes a me nā micro-bumps: In flip-chip packaging, the chip is flipped so that the input/output (I/O) pads on its surface are directly connected to the circuit on the package substrate. Hoʻohanaʻia ka Copper Foil e hana i nā koho balota a me nā micro-bumps ʻO ka paleʻana o ka Thermal haʻahaʻa a me ke kiʻekiʻe kiʻekiʻe o ke keleawe e hōʻoia i ka hoʻohanaʻana i nā hōʻailona a me ka mana.
- Hilinaʻi maikaʻi a me ka hoʻokele Termal
- Alakaʻi alakaʻi i nā mea: Coper FailUa hoʻohana nuiʻia ma ke alakaʻiʻana i ka paleʻana i ka paleʻana,ʻoi aku no ka mana o ka mana o ka mana. The lead frame provides structural support and electrical connection for the chip, requiring materials with high conductivity and good thermal conductivity. Ho'āʻoʻia ka Copper Folis i kēia mau koi, e hōʻemi pono i nā kumukūʻai popo nei i ka hoʻomaikaʻiʻana i ka hana a me ka hana uila.
- ʻO nāʻenehana hana hana: In practical applications, copper foil often undergoes surface treatments such as nickel, tin, or silver plating to prevent oxidation and improve solderability. E hoʻonui houʻia kēia mau hana i ka durability a me ka hilinaʻi o nā bopper foil ma ke alakaʻiʻana i ke kauʻana.
- : System-in-package technology integrates multiple chips and passive components into a single package to achieve higher integration and functional density. Hoʻohanaʻiaʻo Copper Foil e hana i ka hoʻopili kūloko kūloko a lawelawe i ke ala hana i kēia manawa. This application requires copper foil to have high conductivity and ultra-thin characteristics to achieve higher performance in limited packaging space.
- I hoʻohanaʻia i loko o nā papaʻaina hou (RDL): I loko o nā pahu hana Fan-Fan-Fan-Out The high conductivity and good adhesion of copper foil make it an ideal material for building redistribution layers, increasing I/O density and supporting multi-chip integration.
- ʻO nā Copper Foil Sint Sint a me nā kahawai
- Hoʻohanaʻia ma o-silicon via (tsv)ʻenehana
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3. Alakaʻi alakaʻi i ke kauʻana
4. Pūnaewele-in-paget (sip)
5. ʻO nā kāpena Fan-Otter
6. ʻO ka hoʻokele Termal a me nā noi UPSPHTINT
7. Loaʻa i nāʻenehana hana holomua
Post Times: Sep-20-2024