< img kiʻekiʻe = "1" laula = "1" style = "hōʻike:ʻaʻohe" src = "https://www.facebook.com/tr?id=1663378561090394&ev=PageView&noscript=1" /> Nūhou - Copper Foil Nickel Plating: Ke kūkulu ʻana i kahi "Nano-Level Armor" a me ka Pioneering Multi-Functional Integration

Copper Foil Nickel Plating: Ke kūkulu ʻana i kahi "Nano-Level Armor" a me ka Pioneering Multi-Functional Integration

ʻO ka Nickel plating kahi kaʻina hana hoʻololi koʻikoʻi e hana ana i kahi papa hana nickel-based composite i hoʻomalu pono ʻia, e hiki ai.pepa keleawee mālama i ke kūpaʻa kūʻokoʻa ma lalo o nā kūlana koʻikoʻi. Ke ʻimi nei kēia ʻatikala i nā holomua manickel-plated copper foilʻenehana mai ʻekolu kihi—pale wela a me ka corrosion, pale electromagnetic, a me ka hana hou. Ke hoʻohana neiCIVEN METAL's nano-scale nickel plating 'enehana ma ke 'ano he la'ana, e hō'ike ana i ka waiwai o ka mea ma na kula holomua e like me ka ikehu hou a me ka aerospace.

1. Mechanism pale ʻelua a me nā holomua hana o ka Nickel Plating

1.1 Nā Mekini Kino a me Kemika no ka pale ʻana i ka wela kiʻekiʻe
Hāʻawi kahi papa nickel (0.1μm mānoanoa) i ka pale wela kiʻekiʻe ma o:

  • Paʻa wela:He 1455°C ka helu hehee o Nickel (e like me 1085°C o ke keleawe). Ma 200–400°C, he 1/10 wale nō ka nui o kona oxidation o ke keleawe (0.02mg/cm²·h vs. 0.2mg/cm²·h).
  • ʻO ka hoʻopuehu ʻana:Hoʻopaʻa ia i ka neʻe ʻana o ka ʻātoma keleawe i ka ʻili, e hōʻemi ana i ka diffusion coefficient mai 10⁻¹⁴ a i 10⁻¹⁸ cm²/s.
  • Hoʻopaʻa koʻikoʻi:Me ke koena hoʻonui wela o 13.4ppm/°C (hoʻohālikelike ʻia me 17ppm/°C o ke keleawe), ʻoki ʻo ia i ke kaumaha wela ma 40%.

1.2 Kū'ē Kū'ē me kahi Pūnaehana "Ekolu-Dimensional Defense".

ʻAno ʻino

ʻO ka manawa e hāʻule ai (ʻaʻole mālama ʻia)

ʻO ka manawa e hāʻule ai (Nickel-Plated)

Hoʻomaikaʻi

Paʻakai paʻakai (5% NaCl) 24 hola (ʻeleʻele) 2,000 hola (ʻaʻohe corrosion) 83x
ʻakika (pH = 3) 2 hola (perforation) 120 hola (emi iho ma mua o 1% pohō kaumaha) 60x
Alkali (pH = 10) 48 hola (pauka) 720 hola (ʻili pahee) 15x

2. ʻO ka "Golden Rula" o ka 0.1μm Coating
2.1 Kumu ʻepekema no ka hoʻonui ʻana i ka mānoanoa
Hōʻoia ka hoʻohālikelike ʻana i nā mea hoʻokolohua a me ka ʻikepili hoʻokolohua e hāʻawi ana kahi papa nickel 0.1μm i ke koena maikaʻi loa:

  • ka lawe ʻana:Hoʻonui ʻia ka pale ʻana ma 8% wale nō (mai 0.017Ω·mm²/m a i 0.0184Ω·mm²/m).
  • Hana Mechanical:Piʻi ka ikaika tensile i 450MPa (mai 350MPa no ke keleawe ʻole), me ka elongation e koe ma luna o 15%.
  • Hoʻoholo i ke kumu kūʻai:Hoʻemi ʻia ka hoʻohana ʻana o Nickel e 90% i hoʻohālikelike ʻia me nā uhi kuʻuna 1μm, e hōʻemi ana i nā kumukūʻai e 25 CNY/m².

2.2 ʻO ka hopena "Paʻa ʻike ʻole" o ka pale uila uila
Hoʻopili nui ka mānoanoa o ka papa nikela me ka hana pale pale (SE):
SE(dB) = 20 + 50·log₁₀(t/0.1μm)
Ma ka t = 0.1μm, SE = 20dB.
Ma ke alapine 1GHz:

  • Palena kahua uila:>35dB (nā poloka 99.97% radiation).
  • Palena Mākēneki:>28dB (kūpono MIL-STD-461G).

3. CIVEN METAL: Nā haku o ka Nano-Precision Nickel Plating
3.1 Nā Kūlana ʻenehana i ka Electroplating
CIVEN METALhoʻohana i ka pulse electroplating a me ka nano-additive composite techniques:

  • Nā ʻāpana Pulse:ʻO 3A/dm² (80% duty cycle), hoʻohuli i kēia manawa o 0.5A/dm² (20% duty cycle).
  • Nano-Precision Mana:Hoʻokomo ʻia nā hua nickel 2nm (density >10¹² particles/cm²), e loaʻa ana ka nui o ka palaoa ≤20nm.
  • Mānoanoa like ʻole:Coefficient of variation (CV) <3% (ʻoihana awelika >8%).

3.2 Nā Ana Hoʻokō Kiʻekiʻe

Metric

International IPC-4562 Kūlana

CIVEN METALPepa keleawe i uhi ʻia i ka nikela

Pōmaikaʻi

ʻO ke ʻano ʻākeke Ra (μm) ≤0.15 0.05–0.08 -47%
ʻO ka hoʻololi ʻana i ka mānoanoa o ka uhi ʻana (%) ≤±15 ≤±5 -67%
Ka ikaika pili (MPa) ≥20 35–40 +75%
ʻO ka ʻokiʻekiʻe kiʻekiʻe (300°C/24h) Pohō kaumaha ≤2mg/cm² 0.5mg/cm² -75%

3.3 Nā mea hoʻonā i hoʻopili ʻia

  • Hoʻokahi ʻaoʻao Nickel uhi:ʻO ka mānoanoa o 0.08–0.12μm, kūpono no nā kaapuni paʻi maʻalahi (FPC).
  • Ka uhi nikela ʻaoʻao ʻelua:ʻO ka mānoanoa o 0.1μm±0.02μm, hoʻohana ʻia i nā ʻohi ʻohi o kēia manawa.
  • ʻO ka uhi ʻana o ka Gradient:0.1μm nickel ma ka ʻili + 0.05μm cobalt papa hoʻololi, no ka aerospace-level thermal shock resistance.

4. Hoʻohana Hoʻohana Hoʻopau oPepa keleawe i uhi ʻia i ka nikela

4.1 ʻO nā ʻuala uila hou

  • Nā ʻōhua mana:Kāohi nā papa nikela i ka ulu ʻana o ka lithium dendrite, e hoʻolōʻihi i ke ola pōʻaiapuni i>2,000 mau pōʻai (ke keleawe ʻole: 1,200 mau pōʻai).
  • ʻO nā ʻōhua paʻa paʻa:Hoʻonui ʻia ka launa pū ʻana me ka sulfide electrolytes, ke kūpaʻa o ke alo <5Ω·cm² (ke keleawe ʻole >20Ω·cm²).

4.2 ʻEleke Aerospace

  • Nā ʻāpana RF Satellite:ʻO ka pono pale electromagnetic >30dB (Ka band), hoʻokomo poho <0.1dB/cm.
  • Nā ʻenekinia ʻenekini:E kū i ka 800 ° C i ka haʻalulu wela no ka wā pōkole me ka delamination ʻole o ka uhi ʻana (SEM hōʻoia).

4.3 Lako Hana Hana Moana

  • Nā mea hoʻohui i loko o ka moana hohonu:Holo i 3,000-mika hohonu ho'āʻo kaomi (30MPa), corrosion kū'ē Cl⁻ >10 makahiki.
  • Nā mea hoʻohui mana makani waho:ʻO ke ola paʻakai paʻakai> 5,000 hola (IEC 61701-6 standard).

5. Ka wā e hiki mai ana o Nickel Plating Technology

5.1 Nā Papa Hoʻohui Atoma (ALD).
Ke hoʻomohala nei i nā Ni/Al₂O₃ nano-laminates:

  • Palena wela:ʻOi aku ma mua o 600°C (ka nickel plating maʻamau: 400°C).
  • Paʻa ʻino:5x hoʻomaikaʻi (ke ola paʻakai > 10,000 hola).

5.2 Nā uhi pane naʻauao
Hoʻokomo i nā microcapsules pili i ka pH:

  • Hoʻokuʻu i ka mea hoʻokuʻu ʻakomi:Hoʻoikaika nā mea hoʻopaneʻe Benzotriazole i ka wā o ka corrosion, me ka pono hoʻōla ponoʻī> 85%.
  • Hoʻonui i ke ola lawelawe:25 mau makahiki (nā uhi maʻamau: 10-15 mau makahiki).

Hoʻopili ʻia ka nikelapepa keleaweme "ka lōʻihi e like me ke kila" me ka mālama ʻana i ka hana ʻokoʻa i nā kūlana koʻikoʻi. Ma o ka hoʻokō ʻana i ka pololei nano-level a me ka hāʻawi ʻana i nā kaʻina hana maʻamau,CIVEN METALkūlana nickel-platedpepa keleawema ke ʻano he pōhaku kihi no ka hana kiʻekiʻe. Ke piʻi nei ka ikehu hou a me ka ʻimi ākea,nickel-plated copper foile hoʻomau mau ʻia he mea hoʻolālā waiwai nui.


Ka manawa hoʻouna: Apr-17-2025