Hāʻawi ka paʻi tin i kahi "mea kaua metala paʻa" nopepa keleawe, e hōʻeha ana i ke kaulike kūpono ma waena o ka solderability, corrosion resistance, a me ke kumukūʻai kūpono. Ke wehewehe nei kēia ʻatikala pehea i lilo ai ka pahu keleawe i hoʻopaʻa ʻia i ka tin-plated i mea kumu no ka mea kūʻai aku a me ka uila uila. Hōʻike ia i nā mīkini paʻa atomic koʻikoʻi, nā kaʻina hana hou, a me nā noi hoʻohana hope, ʻoiai e ʻimi ana.CIVEN METALnā holomua o ka ʻenehana hoʻoheheʻe tin.
1. ʻEkolu mau pōmaikaʻi nui o ka paʻi ʻana
1.1 He Leʻa Kuantum i ka hana kūʻai
Hoʻololi ka ʻāpana tin (ma kahi o 2.0μm mānoanoa) i ke kūʻai ʻana ma nā ʻano he nui:
- Hoʻoheheʻe Haʻahaʻa Haʻahaʻa: Hoʻoheheʻe ʻia ka tin ma 231.9°C, e hoʻemi ana i ka mahana kūʻai mai ke keleawe 850°C a i ka 250–300°C wale nō.
- Hoʻomaikaʻi i ka hoʻomaʻemaʻe ʻana: hāʻule ka ʻili o ke kino mai ke keleawe 1.3N/m a i ka 0.5N/m, e hoʻonui ana i ka wahi hoʻolaha solder e 80%.
- Nā IMC i hoʻopaʻa ʻia (Intermetallic Compounds): ʻO ka papa gradient Cu₆Sn₅/Cu₃Sn e hoʻonui i ka ikaika shear a hiki i 45MPa (hiki i ka hoʻoheheʻe keleawe ʻole he 28MPa wale nō).
1.2 Kū'ē Kū'ē: He "Dynamic Barrier"
| ʻO ke ʻano ʻino | Manawa Haole Keawe | Kin-Plated Copper Failure Time | Mea Hoomalu |
| Ka Lewa Hanahana | 6 mahina ( ʻeleʻele ʻōmaʻomaʻo) | 5 makahiki (ke kaumaha <2%) | 10x |
| ʻAi ʻino (pH=5) | 72 hola (perforation) | 1,500 hola (ʻaʻohe pōʻino) | 20x |
| ʻO ka waiʻeleʻele hydrogen sulfide | 48 hola (ʻeleʻele) | 800 hola (ʻaʻohe hoʻololi) | 16x |
1.3 Conductivity: He "Micro-Sacrifice" Strategy
- Piʻi iki ka resistivity uila, ma ka 12% (1.72×10⁻⁸ i ka 1.93×10⁻⁸ Ω·m).
- Hoʻomaikaʻi ka hopena o ka ʻili: Ma 10GHz, piʻi ka hohonu o ka ʻili mai 0.66μm a i 0.72μm, e hopena i ka piʻi ʻana o ka pohō hoʻokomo o 0.02dB/cm wale nō.
2. Nā Luʻi Kaʻina Hana: "Ke ʻoki vs. Plating"
2.1 Hoʻopili piha (ʻoki ʻia ma mua o ke kau ʻana)
- Pōmaikaʻi: Ua uhi piha ʻia nā ʻaoʻao, me ke keleawe ʻike ʻole.
- Nā pilikia ʻenehana:
- Pono e hoʻomalu ʻia nā Burrs ma lalo o 5μm (nā hana kuʻuna ma mua o 15μm).
- Pono ke komo ʻana o ka hopena Plating ma mua o 50μm e hōʻoia i ka uhi ʻana o ka ʻaoʻao.
2.2 Hoʻopaʻa ʻia ma hope o ka ʻoki ʻana (Plating Ma mua o ka ʻoki ʻana)
- Nā Pōmaikaʻi Kūʻai: Hoʻonui i ka pono hana e 30%.
- Nā pilikia koʻikoʻi:
- Loaʻa nā kihi keleawe i ʻike ʻia mai 100-200μm.
- Hoʻemi ʻia ke ola paʻakai e 40% (mai 2,000 hola a 1,200 hola).
2.3CIVEN METALʻO ke ala "Zero-Defect".
ʻO ka hui pū ʻana i ka ʻoki pololei ʻana i ka laser me ka pulupulu tin plating:
- Oki Pono: Mālama ʻia nā Burrs ma lalo o 2μm (Ra=0.1μm).
- Kaʻi uhie: ʻaoʻao plating mānoanoa ≥0.3μm.
- Kūʻai-Pono: He 18% ha'aha'a ka uku ma mua o ke ka'ina hana ku'una piha.
3. CIVEN METALPani-PlatedPepa keleawe: He Mare o ka ʻepekema a me ka nani
3.1 Ka Mana Pono o ka Morphology Coating
| ʻAno | Kaʻina hana | Nā mea nui |
| Kino kukui | ʻAno nui o kēia manawa: 2A/dm², mea hoʻohui A-2036 | Hoʻohālikelike >85%, Ra=0.05μm |
| Kino Makana | ʻO ka nui o kēia manawa: 0.8A/dm², ʻaʻohe mea hoʻohui | Hoʻohālikelike <30%, Ra=0.8μm |
3.2 Nā Ana Hoʻokō Kiʻekiʻe
| Metric | ʻAwelika ʻOihana |CIVEN METALKino-Plated Copper | Hoonui |
| Hoʻokaʻawale ka mānoanoa o ka uhi (%) | ±20 | ±5 | -75% |
| Ka helu haʻahaʻa kūʻai (%) | 8–12 | ≤3 | -67% |
| Kū'ē Bend (pōkole) | 500 (R=1mm) | 1,500 | +200% |
| Hoʻonui ʻia ʻo Tin Whisker (μm/1,000h) | 10–15 | ≤2 | -80% |
3.3 Nā ʻāpana noi nui
- Nā FPC kelepona: Mānoanoa uʻi (0.8μm mānoanoa) hōʻoia paʻa soldering no 30μm laina / spacing.
- Nā ECU kaʻa: Kūpaʻa ʻia ke kī ʻālohilohi i 3,000 mau pōʻaiapuni wela (-40°C↔+125°C) me ka pau ʻole o ka hui pū ʻana.
- Nā Pahu Hoʻohui Photovoltaic: Loaʻa i ka hoʻopaʻa ʻana i ka pahu pālua ʻaoʻao ʻelua (1.2μm) i ke kūpaʻa pili <0.5mΩ, hoʻonui i ka pono e 0.3%.
4. ʻO ka wā e hiki mai ana o ka paʻi ʻana
4.1 Nano-Composite Coatings
Ke hoʻomohala nei i nā mea hoʻoheheʻe ʻia ʻo Sn-Bi-Ag:
- ʻO ka helu heheʻe haʻahaʻa i 138°C (kūpono no nā mea uila hikiwawe haʻahaʻa).
- Hoʻomaikaʻi i ke kū ʻana o nā kolo e 3x (ma luna o 10,000 mau hola ma 125°C).
4.2 ʻO ka hoʻololi ʻana i ke kīpē ʻōmaʻomaʻo
- ʻO ka Cyanide-Free Solutions: Hoʻemi i ka wai ʻino COD mai 5,000mg/L a i 50mg/L.
- Kiʻekiʻe Tin Recovery Rate: Ma luna o 99.9%, ʻoki i nā kumukūʻai kaʻina hana e 25%.
Hoʻololi ka paʻi tinpepa keleawemai kahi alakaʻi kumu i loko o kahi "mea hoʻopili naʻauao."CIVEN METAL'O ke ka'ina ka'ina 'ātomaika e ho'oikaika i ka hilina'i a me ka ho'omau 'ana o ke kaiapuni o ka pahu keleawe i uhi 'ia i ke ki'eki'e. E like me ka emi ʻana o nā mea kūʻai uila a koi ʻia nā mea uila automotive i ka hilinaʻi kiʻekiʻe,ipu keleawe i uhi ʻia i ka tin-platedke lilo nei i pōhaku kihi o ka hoʻololi hoʻohui.
Ka manawa hoʻouna: Mei-14-2025