ʻO ke keleawe kekahi o nā metala nui loa o ka honua. ʻO kāna mau mea kūʻokoʻa e kūpono ia no ka nui o nā noi, me ka conductivity uila. Hoʻohana nui ʻia ke keleawe ma nā ʻoihana uila a me nā ʻoihana uila, a ʻo nā pahu keleawe nā mea pono no ka hana ʻana i nā papa kaapuni paʻi (PCB). Ma waena o nā ʻano like ʻole o nā pahu keleawe i hoʻohana ʻia i ka hana ʻana i nā PCB, ʻo ED copper foil ka mea i hoʻohana nui ʻia.
Hana ʻia ʻo ED copper foil e ka electro-deposition (ED), kahi kaʻina hana e pili ana i ka waiho ʻana o nā ʻātoma keleawe ma luna o kahi ʻili metala ma o ke ʻano uila. ʻO ka hopena keleawe keleawe he maʻemaʻe loa, ʻaʻahu, a loaʻa iā ia nā waiwai mechanical a me nā uila.
ʻO kekahi o nā pōmaikaʻi nui o ED copper foil ʻo kona kūlike. ʻO ke kaʻina hana electro-deposition e hoʻopaʻa i ka mānoanoa o ka pahu keleawe ma kona ʻili āpau, he mea koʻikoʻi i ka hana PCB. ʻO ka mānoanoa o ka pahu keleawe ka mea maʻamau i nā microns, a hiki ke loaʻa mai kahi mau microns a hiki i nā ʻumi microns, ma muli o ka noi. Hoʻoholo ka mānoanoa o ka pahu keleawe i kona conductivity uila, a ʻoi aku ka nui o ka conductivity o ka foil mānoanoa.
Ma waho aʻe o kona kūlike, ʻo ED copper foil he mau waiwai mechanical maikaʻi loa. He maʻalahi loa ia a hiki ke maʻalahi, hoʻopili ʻia, a hana ʻia e kūpono i nā contours o ka PCB. ʻO kēia maʻalahi e lilo ia i mea kūpono no ka hana ʻana i nā PCB me nā geometries paʻakikī a me nā hoʻolālā paʻakikī. Eia kekahi, ʻo ka ductility kiʻekiʻe o ka copper foil hiki iā ia ke kū i ka piʻi pinepine ʻana a me ka flexing me ka ʻole o ka haki ʻana a me ka haki ʻole.
ʻO kekahi waiwai koʻikoʻi o ED copper foil kona conductivity uila. ʻO ke keleawe kekahi o nā metala koʻikoʻi loa, a ʻo ED copper foil he conductivity ma luna o 5 × 10^7 S/m. He mea nui kēia pae kiʻekiʻe o ka conductivity i ka hana ʻana o nā PCB, kahi e hiki ai ke hoʻouna i nā hōʻailona uila ma waena o nā ʻāpana. Eia kekahi, ʻo ka haʻahaʻa haʻahaʻa uila o ka copper foil e hōʻemi i ka nalowale o ka ikaika hōʻailona, he mea koʻikoʻi i nā noi kiʻekiʻe a me ka wikiwiki.
ʻO ED copper foil ka mea kūpaʻa loa i ka oxidation a me ka corrosion. Hoʻopili ke keleawe me ka oxygen i ka lewa e hana i kahi ʻāpana lahilahi o ke keleawe oxide ma luna o kona ʻili, hiki ke hoʻololi i kona conductivity uila. Eia nō naʻe, ua uhi ʻia ka ED copper foil me kahi papa o nā mea pale, e like me ka tin a i ʻole nickel, e pale aku i ka hoʻoneʻe ʻana a hoʻomaikaʻi i kona solderability.
I ka hopena, ʻo ED copper foil he mea maʻalahi a koʻikoʻi i ka hana ʻana o nā PCB. ʻO kona kūlike, ka maʻalahi, ka conductivity uila kiʻekiʻe, a me ke kū'ē i ka oxidation a me ka corrosion e lilo ia i mea kūpono no ka hana ʻana i nā PCB me nā geometries paʻakikī a me nā koi kiʻekiʻe. Me ka piʻi nui o ka noi no nā uila uila kiʻekiʻe a me nā kiʻekiʻe kiʻekiʻe, ʻo ke koʻikoʻi o ka ED copper foil e hoʻonohonoho wale ʻia e hoʻonui i nā makahiki e hiki mai ana.
Ka manawa hoʻouna: Feb-17-2023