< img kiʻekiʻe = "1" laula = "1" style = "hōʻike:ʻaʻohe" src = "https://www.facebook.com/tr?id=1663378561090394&ev=PageView&noscript=1" /> Nūhou - Passivated Rolled Copper Foil: Hana ʻana i ke ʻano o "Corrosion Protection Shields" a me ke kaulike hana.

ʻO Passivated Rolled Copper Foil: Hana ʻana i ke ʻano o "Corrosion Protection Shields" a me ke kaulike hana.

ʻO ka passivation kahi hana koʻikoʻi i ka hana ʻana o ka ʻōwilipepa keleawe. Hana ʻo ia ma ke ʻano he "pale molecular-level" ma luna o ka ʻili, e hoʻonui ana i ka pale ʻana i ka corrosion ʻoiai ke kaupaona pono ʻana i kona hopena i nā waiwai koʻikoʻi e like me ka conductivity a me ka solderability. Hoʻopili kēia ʻatikala i ka ʻepekema ma hope o nā mīkini passivation, nā kālepa hana, a me nā hana ʻenekinia. Ke hoʻohana neiCIVEN METALʻO nā mea holomua ma ke ʻano he laʻana, e ʻimi mākou i kona waiwai kūʻokoʻa i ka hana uila uila kiʻekiʻe.

1. Passivation: He "Molecular-Level Shield" no Copper Foil

1.1 Pehea e hoʻokumu ʻia ai ka Layer Passivation
Ma o ka hoʻomaʻamaʻa kemika a i ʻole ka electrochemical, hoʻokumu ʻia kahi ʻāpana oxide compact 10-50nm mānoanoa ma ka ʻili o kapepa keleawe. Hoʻokumu nui ʻia nā Cu₂O, CuO, a me nā paʻakikī organik, hāʻawi kēia papa:

  • ʻO nā pale kino:E emi ana ka huina hoolaha o ka oxygen i 1×10⁻¹⁴ cm²/s (lalo mai 5×10⁻⁸ cm²/s no ke keleawe kala ole).
  • Electrochemical Passivation:Ke hāʻule nei ka nui o ka corrosion mai 10μA/cm² a i 0.1μA/cm².
  • Kemikini inertness:Hoʻemi ʻia ka ikehu manuahi o ka ʻili mai 72mJ/m² a i 35mJ/m², ke kāohi nei i ka hana hoʻopono.

1.2 ʻElima Pōmaikaʻi Nui o ka Passivation

Hana Hana

Pepa keleawe i hooponopono ole ia

Paʻi keleawe paʻi

Hoʻomaikaʻi

Ho'āʻo Paʻakai paʻakai (mau hola) 24 (ʻike ʻia nā kiko ʻōpala) 500 (ʻaʻole ʻike ʻia ka corrosion) +1983%
ʻO ka hoʻonanea kiʻekiʻe (150°C) 2 hola (ʻeleʻele) 48 hola (mālama ke kala) +2300%
Ola mālama 3 mahina 18 mahina (paʻa maʻamau) +500%
Palekana pili (mΩ) 0.25 0.26 (+4%)
Nalo hoʻokomo ʻana i nā alapine kiʻekiʻe (10GHz) 0.15dB/cm 0.16dB/cm (+6.7%)

2. ʻO ka "Pahi Makalua" o nā ʻāpana Passivation - a pehea e kaulike ai.

2.1 Ka Loiloi ana i na Pilikia

  • Hoʻemi iki i ka hana ʻana:Hoʻonui ka papa passivation i ka hohonu o ka ʻili (ma 10GHz) mai 0.66μm a i 0.72μm, akā ma ka mālama ʻana i ka mānoanoa ma lalo o 30nm, hiki ke kaupalena ʻia ka piʻi ʻana o ka resistivity ma lalo o 5%.
  • ʻO nā pilikia kūʻai:Hoʻonui ka ikehu ʻili haʻahaʻa i nā kihi hoʻoheheʻe solder mai 15° a 25°. Hiki i ka hoʻohana ʻana i nā paʻi solder ikaika (ʻano RA) ke hoʻopau i kēia hopena.
  • Nā pilikia pili:Hiki ke hāʻule ka ikaika hoʻopaʻa Resin i ka 10-15%, hiki ke hoʻemi ʻia ma ka hoʻohui ʻana i nā kaʻina hana a me ka passivation.

2.2CIVEN METAL'O ke Kaulike 'ana

ʻO ka ʻenehana ʻo Gradient Passivation:

  • Papa kumu:Electrochemical ulu o 5nm Cu₂O me (111) makemake orientation.
  • Lae waena:He kiʻiʻoniʻoni i hui pū ʻia me benzotriazole (BTA) 2-3nm.
  • ʻO waho:Silane coupling agent (APTES) e hoʻonui i ka resin adhesion.

Nā hualoaʻa hana i hoʻoikaika ʻia:

Metric

IPC-4562 Koi

CIVEN METALNā hualoaʻa Copper Foil

Palekana ʻili (mΩ/sq) ≤300 220–250
Ka ikaika iʻi (N/cm) ≥0.8 1.2–1.5
ʻO ka ikaika o ka hoʻohui ʻana i ka ʻili (MPa) ≥25 28–32
Ka Laki Hoʻoneʻe Ionic (μg/cm²) ≤0.5 0.2–0.3

3. CIVEN METALʻO ka ʻenehana Passivation: Hoʻololi hou i nā Kūlana Palekana

3.1 He Pūnaehana Palekana ʻEhā

  1. Manaʻo ʻOxide Māmā:Hiki i ka anodization Pulse ke hoʻololi ʻana i ka mānoanoa i loko o ± 2nm.
  2. ʻO nā ʻōnaʻi ʻanoʻano like ʻole:Hana pū ka BTA a me ka silane e hōʻemi i ka nui o ka corrosion i 0.003mm/makahiki.
  3. Lapaʻau hoʻoulu ʻana i ka ʻili:Hoʻihoʻi ka hoʻomaʻemaʻe ʻana i ka plasma (Ar/O₂ gas hui) i 18°.
  4. Ka nānā ʻana i ka manawa maoli:Mālama ʻo Ellipsometry i ka mānoanoa o ka papa passivation i loko o ± 0.5nm.

3.2 Hōʻoia Kaiapuni Loa

  • Kiʻekiʻe Humidity a me ka wela:Ma hope o 1,000 mau hola ma 85°C/85% RH, hoʻololi ka pale ʻana o ka ʻili ma lalo o 3%.
  • Puka wela:Ma hope o 200 mau pōʻai o -55°C a i +125°C, ʻaʻohe māwae i ʻike ʻia ma ka papa passivation (hōʻoia ʻia e SEM).
  • Palekana Kemika:ʻO ke kū'ēʻana i ka 10% HCl vapor piʻi mai 5 minuke a 30 minuke.

3.3 Hoʻohālikelike i nā noi

  • 5G Millimeter-Wave Antennas:Hoʻemi ʻia ka poho hoʻokomo 28GHz i 0.17dB/cm wale nō (i hoʻohālikelike ʻia me 0.21dB/cm) o nā mea hoʻokūkū.
  • Kaʻa uila:Holo i ka ISO 16750-4 i nā hoʻāʻo paʻakai paʻakai, me nā pōʻai lōʻihi i 100.
  • Nā ʻāpana IC:ʻO ka ikaika adhesion me ka resin ABF hiki i ka 1.8N / cm (ka awelika ʻoihana: 1.2N / cm).

4. ʻO ka hope o ka ʻenehana Passivation

4.1 ʻOihana Hoʻopaʻa ʻAtomic Layer Deposition (ALD).
Ke hoʻomohala nei i nā kiʻiʻoniʻoni passivation nanolaminate ma muli o Al₂O₃/TiO₂:

  • mānoanoa:<5nm, me ka hoʻonui resistivity ≤1%.
  • Kū'ē CAF (Conductive Anodic Filament):5x hoʻomaikaʻi.

4.2 Ho'ola Pa'i Pa'i Pono
Hoʻohui pū i nā mea hoʻopaneʻe microcapsule corrosion (benzimidazole derivatives):

  • ʻO ka pono hoʻōla ponoʻī:Ma luna o 90% i loko o 24 mau hola ma hope o nā ʻōpala.
  • Ke ola lawelawe:Hoʻonui ʻia i 20 mau makahiki (hoʻohālikelike ʻia i ka makahiki 10-15 maʻamau).

Ka hopena:
Loaʻa ka lapaʻau Passivation i kahi kaulike maʻemaʻe ma waena o ka pale a me ka hana no ka ʻōwilipepa keleawe. Ma o ka hana hou,CIVEN METALhōʻemi i ka haʻahaʻa o ka passivation, e hoʻohuli iā ia i "mea kaua ʻike ʻole" e hoʻonui ai i ka hilinaʻi huahana. Ke neʻe nei ka ʻoihana uila i ke kiʻekiʻe kiʻekiʻe a me ka hilinaʻi, ua lilo ka passivation pololei a hoʻomalu ʻia i pōhaku kihi o ka hana ʻana i ke keleawe keleawe.


Ka manawa hoʻouna: Mar-03-2025