Ma ke kahua opepa keleawe'oihana, roughening post-treatment 'o ia ke ki kaʻina hana no ka wehe 'ana i ka mea o ka pilina pili ikaika. Hoʻopili kēia ʻatikala i ka pono o ka hoʻomaʻamaʻa ʻana mai ʻekolu mau hiʻohiʻona: ka hopena heleuma mechanical, nā ala hoʻokō kaʻina hana, a me ka hiki ke hoʻohana hope. E ʻimi pū ana i ka waiwai noi o kēia ʻenehana i nā kula e like me ka kamaʻilio 5G a me nā pihi ikehu hou, e pili ana iCIVEN METALnā holomua ʻenehana.
1. Hoʻomaʻamaʻa hoʻomāinoino: Mai ka "Smooth Trap" a i ka "Anchored Interface"
1.1 ʻO nā hemahema o ka ʻili maʻemaʻe
ʻO ka ʻōkole kumu (Ra) opepa keleaweʻOi aku ka liʻiliʻi o nā surfaces ma mua o 0.3μm, e alakaʻi ana i kēia mau pilikia ma muli o kāna mau hiʻohiʻona e like me ke aniani:
- ʻAʻole lawa ka hoʻopaʻa kino: ʻO ka wahi hoʻopili me ka resin he 60-70% wale nō o ka waiwai theoretical.
- Pale Hoʻopaʻa Kimia: ʻO kahi papa oxide mānoanoa (Cu₂O mānoanoa ma kahi o 3-5nm) ke keʻakeʻa nei i ka ʻike ʻana o nā pūʻulu ikaika.
- ʻO ke koʻikoʻi wela: Hiki i nā ʻokoʻa o ka CTE (Coefficient of Thermal Expansion) ke hoʻopau i ka delamination interface (ΔCTE = 12ppm/°C).
1.2 ʻEkolu Kiʻekiʻe Kiʻekiʻe ʻenehana i nā kaʻina hana hoʻopololei
| Kaʻina hana | Kuʻuna Copper Foil | Pepa keleawe a'a | Hoʻomaikaʻi |
| ʻO ke ʻano ʻākeke Ra (μm) | 0.1-0.3 | 0.8-2.0 | 700-900% |
| ʻAi Ili Kūikawā (m²/g) | 0.05-0.08 | 0.15-0.25 | 200-300% |
| Ka ikaika iʻi (N/cm) | 0.5-0.7 | 1.2-1.8 | 140-257% |
Ma ka hana ʻana i kahi ʻano ʻekolu-dimensional micron-level (e ʻike i ke Kiʻi 1), ua loaʻa i ka papa ʻākala:
- Mechanical Interlocking: ʻO ke komo ʻana o ka resin i ka heleuma "barbed" (hohonu > 5μm).
- Hoʻola Kemika: ʻO ka hōʻike ʻana i (111) mau mokulele aniani hana kiʻekiʻe e hoʻonui ai i ka nui o ka pūnaewele hoʻopaʻa ʻana i nā pūnaewele 10⁵/μm².
- Hoʻopaʻa Koʻikoʻi Thermal: Hoʻopili ka hale porous ma luna o 60% o ke kaumaha wela.
- Alanui Kaʻina: ʻAkika copper plateing solution (CuSO₄ 80g/L, H₂SO₄ 100g/L) + Pulse Electro-deposition (kūlana hana 30%, alapine 100Hz)
- Nā hiʻohiʻona hoʻolālā:
- Copper dendrite kiekie 1.2-1.8μm, anawaena 0.5-1.2μm.
- ʻO ka ʻike oxygen i luna ≤200ppm (XPS analysis).
- Kūleʻa pili <0.8mΩ·cm².
- Alanui Kaʻina: Kobalt-nickel alloy plateing solution (Co²+ 15g/L, Ni²+ 10g/L) + Chemical Displacement Reaction (pH 2.5-3.0)
- Nā hiʻohiʻona hoʻolālā:
- ʻO ka nui o CoNi alloy particle 0.3-0.8μm, hoʻopaʻa haʻahaʻa > 8×10⁴ mau ʻāpana/mm².
- ʻO ka ʻike oxygen ma luna o ≤150ppm.
- Kūleʻa pili <0.5mΩ·cm².
2. 'Oxidation 'ula'ula vs. 'Oxidation 'Ele'ele: 'O ke ka'ina hana huna ma hope o na kala
2.1 ʻOka ʻulaʻula: ʻO ka "Armor" o Copper
2.2 ʻEleʻele Oxidation: ʻO ka Alloy "Armor"
2.3 Loko Kalepa Ma hope o ke Koho Kala
ʻOiai ʻokoʻa nā hōʻailona hana koʻikoʻi (adhesion a conductivity) o ka ʻulaʻula a me ka ʻeleʻele oxidation ma lalo o 10%, hōʻike ka mākeke i kahi ʻokoʻa maopopo.
- Pepa keleawe ʻulaʻula: Loaʻa i ka 60% o ka māhele mākeke ma muli o kona waiwai nui (12 CNY/m² vs. ʻeleʻele 18 CNY/m²).
- Pepa keleawe ʻeleʻele: Hoʻomalu i ka mākeke kiʻekiʻe (FPC i kau ʻia i ke kaʻa, nā PCB millimeter-wave) me ka māhele mākeke 75% ma muli o:
- 15% ka ho'ēmiʻana i nā poho kiʻekiʻe (Df = 0.008 vs. red oxidation 0.0095 ma 10GHz).
- 30% hoʻomaikaʻi i ka CAF (Conductive Anodic Filament).
3. CIVEN METAL: "Nano-Level Masters" o Roughening Technology
3.1 ʻenehana hou "Gradient Roughening".
Ma o ka mana kaʻina hana ʻekolu,CIVEN METALhoʻonui i ka hoʻolālā ʻili (e nānā i ke Kiʻi 2):
- ʻO Nano-Crystalline Hua Hua: Electro-deposition o na kopa keleawe 5-10nm i ka nui, density > 1×10¹¹ particles/cm².
- Ka ulu ʻana o Micron Dendrite: Hoʻoponopono ʻia ka mana o ka dendrite i kēia manawa (hoʻomua i ka ʻaoʻao (110)).
- ʻO ka hoʻokuʻu ʻana i ka ʻili: Hoʻomaikaʻi ka hoʻopili ʻana i ka silane coupling agent (APTES) i ka pale ʻana i ka oxidation.
3.2 Hana ʻoi aku ma mua o nā kūlana ʻoihana
| Mea hoao | IPC-4562 Kūlana | CIVEN METALʻIkepili Ana | Pōmaikaʻi |
| Ka ikaika iʻi (N/cm) | ≥0.8 | 1.5-1.8 | + 87-125% |
| Ka Waiwai CV ʻO Roughness Ili | ≤15% | ≤8% | -47% |
| Pau ka pauka (mg/m²) | ≤0.5 | ≤0.1 | -80% |
| ʻO ke kūpaʻa haʻahaʻa (h) | 96 (85°C/85%RH) | 240 | +150% |
3.3 Hoʻohana Hoʻohana Hoʻopau Matrix
- 5G Base Station PCB: Hoʻohana i ka ʻeleʻele keleawe oxidized ʻeleʻele (Ra = 1.5μm) e loaʻa ai <0.15dB/cm hoʻokomo poho ma 28GHz.
- Nā ʻOhi Puka Mana: Ula oxidizedpepa keleawe(ʻO ka ikaika tensile 380MPa) hāʻawi i ke ola pōʻaiapuni> 2000 mau pōʻaiapuni (nā kaʻina aupuni 1500 cycles).
- Aerospace FPCs: Ke ku'e nei ka papa oolea mai -196°C a i +200°C no 100 mau kaapuni me ka delamination ole.
4. Ke kahua kaua no ka wā e hiki mai ana no ka ʻōpala keleawe ʻoʻoleʻa
4.1 ʻenehana Ultra-Roughening
No nā koi kamaʻilio 6G terahertz, ke kūkulu ʻia nei kahi hale serrated me Ra = 3-5μm:
- Paʻa Paʻa Dielectric: Hoʻonui i ka ΔDk <0.01 (1-100GHz).
- Kū'ē wela: Hoemi ia e 40% (hiki i ka 15W/m·K).
4.2 Pūnaehana Roughening akamai
Hoʻohui ʻia ka ʻike maka AI + hoʻoponopono kaʻina hana ikaika:
- Ka nānā ʻana i ka ʻili o ka manawa maoli: ʻO ke alapine o ka laʻana 100 mau papa i kekona.
- Hoʻololi ʻana i ka Density o kēia manawa: Pono ±0.5A/dm².
Ua ulu ka copper foil roughening post-treatment mai kahi "kaʻina koho" a i ka "mea hoʻonui hana." Ma o ke kaʻina hana hou a me ka mana maikaʻi loa,CIVEN METALua hoʻoikaika i ka ʻenehana hoʻoikaika kino i ka pololei pae atomic, e hāʻawi ana i ke kākoʻo kumu kumu no ka hoʻomaikaʻi ʻana i ka ʻoihana uila. I ka wā e hiki mai ana, i ka heihei no nā ʻenehana ʻoi aku ka maikaʻi, ʻoi aku ka kiʻekiʻe, a ʻoi aku ka hilinaʻi, ʻo ka mea nāna i haku i ka "micro-level code" o ka ʻenehana roughening e noho aliʻi i ke kahua kiʻekiʻe o ka honua.pepa keleaweʻoihana.
(Kumu ʻikepili:CIVEN METAL2023 Hōʻike ʻenehana makahiki, IPC-4562A-2020, IEC 61249-2-21)
Ka manawa kau: Apr-01-2025