Electrodeposited (ED)pepa keleaweʻo ia ka iwi kuamoʻo ʻike ʻole ʻia o nā uila uila hou. ʻO kona ʻano kikoʻī ultra-thin, kiʻekiʻe ductility, a me ka conductivity maikaʻi loa e pono ai i nā pā lithium, PCB, a me nā uila uila. ʻAʻole likepepa keleawe i ʻōwili ʻia, e hilinaʻi ana i ka deformation mechanical,ED keleawe pepahana ʻia e ka electrochemical deposition, ka loaʻa ʻana o ka mana atomic-level a me ka hana maʻamau. Hōʻike kēia ʻatikala i ka pololei ma hope o kāna hana ʻana a pehea e hoʻololi ai nā hana hou i nā ʻoihana.
I. Standardized Production: Precision ma Electrochemical 'enekinia
1. Hoʻomākaukau Electrolyte: He Nano-Optimized Formula
ʻO ka electrolyte kumu he keleawe sulfate maʻemaʻe kiʻekiʻe (80–120g/L Cu²⁺) a me ka sulfuric acid (80–150g/L H₂SO₄), me ka gelatin a me ka thiourea i hoʻohui ʻia ma nā pae ppm. Hoʻoponopono nā ʻōnaehana DCS kiʻekiʻe i ka mahana (45–55°C), kahe kahe (10–15 m³/h), a me ka pH (0.8–1.5) me ka pololei. Hoʻopili nā mea hoʻohui i ka cathode e alakaʻi i ka hoʻokumu ʻana i ka palaoa nano-level a pale i nā hemahema.
2. Hoʻomoe Foil: ʻAtomic pololei i ka hana
I loko o nā pūnaewele electrolytic me ka titanium cathode rolls (Ra ≤ 0.1μm) a me ke alakaʻi anodes alloy, 3000–5000 A/m² DC i kēia manawa e hoʻolele i ka ion deposition ma luna o ka cathode ili ma (220) orientation. Hoʻopili pololei ʻia ka mānoanoa Foil (6–70μm) ma o ka wikiwiki o ka ʻōwili (5–20 m/min) a me nā hoʻoponopono o kēia manawa, e loaʻa ana i ka mana mānoanoa ± 3%. Hiki i ka pepa lahilahi ke hiki i ka 4μm—1/20th ka mānoanoa o ka lauoho kanaka.
3. Holoi: Nā ʻili maʻemaʻe loa me ka wai maʻemaʻe
Hoʻohana ka ʻōnaehana hoʻomaʻemaʻe hoʻohuli ʻekolu i nā koena a pau: Hoʻohana ka pae 1 i ka wai maʻemaʻe (≤5μS/cm), hoʻohana ka pae 2 i nā hawewe kani ultrasonic (40kHz) no ka hoʻopau ʻana i nā ʻano mea ola, a hoʻohana ka pae 3 i ka ea wela (80–100°C) no ka maloʻo ʻole. ʻO kēia ka hopena mapepa keleaweme nā pae oxygen <100ppm a me nā koena sulfur <0.5μg/cm².
4. ʻO ka Slitting a me ka Packaging: Precision i ka Micron Hope
ʻO nā mīkini slitting kiʻekiʻe me ka mana laser lihi e hōʻoia i ka hoʻomanawanui ākea i loko o ± 0.05mm. Mālama ʻo Vacuum anti-oxidation packaging me nā hōʻailona humidity i ka maikaʻi o ka ʻili i ka wā o ka lawe ʻana a me ka mālama ʻana.
II. Hoʻoponopono Hoʻomaʻamaʻa Ili: Wehe i ka hana ʻoihana kikoʻī
1. Hoʻomaʻamaʻa Roughening: Micro-Anchoring for Enhanced Bonding
Nodule lapaʻau:Hoʻokumu ka Pulse plating ma CuSO₄-H₂SO₄-As₂O₃ solution 2-5μm nodules ma ka ʻili pepa, hoʻomaikaʻi i ka ikaika adhesion i 1.8–2.5N/mm—kūpono no nā papa kaapuni 5G.
ʻO ka hoʻokalakala ʻana i ʻelua-peak:Hoʻonui ka micro- a me ka nano-scale copper particles i ka ʻili ma 300%, e hoʻomaikaʻi ana i ka slurry adhesion i nā anodes pākahi lithium e 40%.
2. Hoʻopaʻa ʻana i ka hana: ʻO nā mea kaua Molecular-Scale no ka lōʻihi
Hoʻopaʻa Zinc/Tin:ʻO kahi papa metala 0.1–0.3μm e hoʻolōʻihi i ka pale ʻana i ka paʻakai mai 4 a 240 mau hola, e hoʻolilo iā ia i mea e hele ai no nā pā pākaukau EV.
ʻO ka uhi ʻana o Nickel-Cobalt Alloy:Hiki i nā ʻāpana nano-palaoa Pulse-plated (≤50nm) i ka paʻakikī HV350, e kākoʻo ana i nā substrate hiki ke hoʻopaʻa ʻia no nā kelepona hiki ke pelu.
3. Kū'ē Kūlana Kiʻekiʻe: Ke ola nei i ka Extreme
Kōkua ʻo Sol-gel SiO₂-Al₂O₃ (100–200nm) i ka pale i ka pale ʻana i ka oxidation ma 400°C (oxidation <1mg/cm²), e hoʻohālikelike pono ana i nā ʻōnaehana uwea aerospace.
III. Hoʻoikaika i ʻekolu mau palena ʻoihana nui
1. Nā Ba'a Manahu Hou
ʻO ka 3.5μm foil o CIVEN METAL (≥200MPa tensile, ≥3% elongation) hoʻonui i ka 18650 ikehu puʻupuʻu e 15%. ʻO ka pepa perforated maʻamau (30-50% porosity) kōkua i ka pale ʻana i ka hoʻokumu ʻana o ka lithium dendrite i loko o nā ʻeke paʻa.
2. Nā PCB kiʻekiʻe
ʻO ka pepa haʻahaʻa haʻahaʻa (LP) me Rz ≤1.5μm e hōʻemi ana i ka nalowale o ka hōʻailona ma nā papa hawewe millimeter 5G e 20%. Kākoʻo ʻo Ultra-low profile (VLP) me ka reverse-treated finish (RTF) i ka helu ʻikepili o 100Gb/s.
3. Mea Elele Hiki
Hana ʻiaED keleawe pepa(≥20% elongation) laminated me PI films withstands over 200,000 bends (1mm radius), acting as the "flexible skeleton" of wearables.
IV. CIVEN METAL: ʻO ke alakaʻi hoʻoponopono ma ED Copper Foil
Ma ke ʻano he hale mana mālie ma ED copper foil,CIVEN METALua kūkulu ʻo ia i kahi ʻōnaehana hana agile, modular:
Hale Waihona Puke Nano-Additive:Ma luna o 200 mau hui hoʻohui i hoʻohālikelike ʻia no ka ikaika tensile kiʻekiʻe, elongation, a me ka paʻa wela.
Hana ʻia ʻo Foil Alakaʻi AI:ʻO nā ʻāpana AI-optimized e hōʻoia i ka pololei o ka mānoanoa ± 1.5% a me ka palahalaha ≤2I.
Kahua lapaʻau ʻili:12 laina i hoʻolaʻa ʻia e hāʻawi ana i 20+ mau koho maʻamau (roughening, plating, coatings).
Hoʻolaha Kūʻai:Hoʻonui ka hoʻihoʻi ʻana i ka ʻōpala ma ka laina i ka hoʻohana ʻana i ke keleawe maka i 99.8%, e hōʻemi ana i nā kumukūʻai foil maʻamau e 10-15% ma lalo o ka awelika mākeke.
Mai ka mana lattice atomic a hiki i ka hoʻokō ʻana i ka hana macro-scale,ED keleawe pepahōʻike i kahi au hou o ka ʻenehana waiwai. E like me ka neʻe ʻana o ka honua i ka electrification a me nā polokalamu akamai,CIVEN METALke alakaʻi nei i ka hoʻopiʻi me kāna kumu hoʻohālike "atomic precision + application innovation"—e hoʻokuke ana i ka hana holomua o Kina i luna o ke kaulahao waiwai honua.
Ka manawa hoʻouna: Jun-03-2025