Ua hoʻolilo ka ʻoihana mea PCB i ka manawa nui i ka hoʻomohala ʻana i nā mea e hāʻawi ana i ka nalowale hōʻailona haʻahaʻa loa. No nā hoʻolālā wikiwiki a me ke alapine kiʻekiʻe, e kaupalena nā pohō i ka mamao hoʻolaha hōʻailona a hoʻopilikia i nā hōʻailona, ​​a e hana ia i kahi ʻokoʻa impedance e hiki ke ʻike ʻia ma nā ana TDR. I ko mākou hoʻolālā ʻana i kekahi papa kaapuni i paʻi ʻia a hoʻomohala i nā kaapuni e hana ana ma nā alapine kiʻekiʻe, he mea hoʻowalewale paha ke koho i ke keleawe maʻalahi loa i nā hoʻolālā āpau āu e hana ai.

ʻOiai he ʻoiaʻiʻo e hoʻokumu ka ʻoʻoleʻa keleawe i ka ʻokoʻa impedance a me nā pohō hou aʻe, pehea ka laumania o kāu foil keleawe? Aia kekahi mau ʻano maʻalahi hiki iā ʻoe ke hoʻohana e lanakila ai i nā pohō me ke koho ʻole ʻana i ke keleawe ultra-laumania no kēlā me kēia hoʻolālā? E nānā mākou i kēia mau kiko ma kēia ʻatikala, a me nā mea hiki iā ʻoe ke nānā inā hoʻomaka ʻoe e kūʻai i nā mea hoʻopaʻa PCB.

Nā ʻano oPepa kini keleawe PCB

ʻO ka maʻamau ke kamaʻilio mākou e pili ana i ke keleawe ma nā mea PCB, ʻaʻole mākou e kamaʻilio e pili ana i ke ʻano kikoʻī o ke keleawe, kamaʻilio wale mākou e pili ana i kona ʻoʻoleʻa. ʻO nā ʻano hana waiho keleawe like ʻole e hana i nā kiʻiʻoniʻoni me nā waiwai ʻoʻoleʻa like ʻole, hiki ke hoʻokaʻawale maopopo ʻia i loko o kahi kiʻi microscope electron scanning (SEM). Inā ʻoe e hana ana ma nā alapine kiʻekiʻe (maʻamau 5 GHz WiFi a i ʻole ma luna) a i ʻole ma nā wikiwiki kiʻekiʻe, a laila e hoʻolohe i ke ʻano keleawe i kuhikuhi ʻia ma kāu pepa ʻikepili mea.

Eia kekahi, e hōʻoia e hoʻomaopopo i ke ʻano o nā waiwai Dk i loko o kahi pepa ʻikepili. E nānā i kēia kūkākūkā podcast me John Coonrod mai Rogers e aʻo hou e pili ana i nā kikoʻī Dk. Me kēlā manaʻo, e nānā kākou i kekahi o nā ʻano like ʻole o ka pepa keleawe PCB.

Hoʻopaʻa ʻia i ka uila

Ma kēia kaʻina hana, ua milo ʻia kahi pahu ma o kahi hopena electrolytic, a ua hoʻohana ʻia kahi hopena electrodeposition e "hoʻoulu" i ka pepa keleawe ma luna o ka pahu. I ka wā e wili ai ka pahu, ua wahī mālie ʻia ka ʻili keleawe hopena ma luna o kahi wili, e hāʻawi ana i kahi pepa keleawe mau e hiki ke ʻōwili ʻia ma hope ma luna o kahi laminate. ʻO ka ʻaoʻao pahu o ke keleawe e kūlike me ka ʻoʻoleʻa o ka pahu, ʻoiai ʻo ka ʻaoʻao i hōʻike ʻia e ʻoi aku ka ʻoʻoleʻa.

Pepa keleawe PCB i hoʻopaʻa ʻia

Ka hana ʻana i ke keleawe i hoʻopaʻa ʻia i ka electrodeposited.
I mea e hoʻohana ʻia ai i loko o ke kaʻina hana PCB maʻamau, e hoʻopaʻa mua ʻia ka ʻaoʻao ʻino o ke keleawe i kahi dielectric glass-resin. Pono e hoʻopaʻa pono ʻia ke keleawe i koe (ʻaoʻao pahu) ma ke ʻano kemika (e laʻa, me ke etching plasma) ma mua o ka hoʻohana ʻia ʻana i loko o ke kaʻina hana lamination keleawe maʻamau. E hōʻoia kēia e hiki ke hoʻopaʻa ʻia i ka papa aʻe ma ka PCB stackup.

Keleawe i hoʻopaʻa ʻia i ka ʻili i mālama ʻia

ʻAʻole maopopo iaʻu ka huaʻōlelo maikaʻi loa e hoʻopuni ana i nā ʻano ʻokoʻa like ʻole o ka ʻili i mālama ʻianā pepa keleawe, pēlā ke poʻomanaʻo ma luna. ʻIke nui ʻia kēia mau mea keleawe he mau foil i hana ʻia ma hope, ʻoiai aia ʻelua mau ʻano like ʻole (e nānā ma lalo).

Hoʻohana nā foil i mālama ʻia i hope i kahi mālama ʻili i hoʻopili ʻia i ka ʻaoʻao laumania (ʻaoʻao pahu) o kahi pepa keleawe i hoʻopili ʻia i ka electrodeposited. ʻO kahi papa mālama he uhi lahilahi wale nō ia e hoʻopōʻino i ke keleawe, no laila e ʻoi aku ka pipili ʻana i kahi mea dielectric. Hana pū kēia mau mālama ʻana ma ke ʻano he pale oxidation e pale ai i ka pala. Ke hoʻohana ʻia kēia keleawe e hana i nā panela laminate, ua hoʻopaʻa ʻia ka ʻaoʻao i mālama ʻia i ka dielectric, a ʻo ka ʻaoʻao ʻino i koe e waiho ʻia. ʻAʻole pono ka ʻaoʻao i hōʻike ʻia i kekahi roughening hou ma mua o ke kālai ʻana; e loaʻa iā ia ka ikaika e hoʻopaʻa ai i ka papa aʻe ma ka PCB stackup.

ʻEkolu mau ʻano like ʻole ma ka pepa keleawe i mālama ʻia ma hope:

Pepa keleawe hoʻolōʻihi wela kiʻekiʻe (HTE): He pepa keleawe electrodeposited kēia e kūlike ana me nā kikoʻī IPC-4562 Grade 3. Hoʻohana ʻia ka ʻaoʻao i hōʻike ʻia me kahi pale oxidation e pale aku i ka pala i ka wā e mālama ai.
Pepa kini i mālama ʻia i ka pālua: Ma kēia pepa kini keleawe, ua hoʻopili ʻia ka mālama ʻana ma nā ʻaoʻao ʻelua o ke kiʻiʻoniʻoni. I kekahi manawa ua kapa ʻia kēia mea he pepa kini i mālama ʻia ma ka ʻaoʻao pahu.
Keleawe pale: ʻAʻole i hoʻokaʻawale pinepine ʻia kēia ma ke ʻano he keleawe i mālama ʻia ma ka ʻili. Hoʻohana kēia pepa keleawe i kahi uhi metala ma luna o ka ʻaoʻao matte o ke keleawe, a laila e hoʻopōʻino ʻia i ka pae i makemake ʻia.
He maʻalahi ka hoʻopili ʻana o ka mālama ʻili i loko o kēia mau mea keleawe: ua ʻōwili ʻia ka foil ma o nā ʻauʻau electrolyte hou e hoʻopili ana i kahi uhi keleawe lua, a ukali ʻia e kahi papa hua pale, a ʻo ka hope loa kahi papa ʻili anti-tarnish.

Pepa keleawe PCB

Nā kaʻina hana mālama ʻili no nā foil keleawe. [Kumu: Pytel, Steven G., et al. "Ka loiloi ʻana i nā mālama keleawe a me nā hopena ma ka hoʻolaha hōʻailona." I ka makahiki 2008 58th Electronic Components and Technology Conference, pp. 1144-1149. IEEE, 2008.]
Me kēia mau kaʻina hana, loaʻa iā ʻoe kahi mea hiki ke hoʻohana maʻalahi ʻia i ke kaʻina hana hana papa maʻamau me ka liʻiliʻi o ka hana hou ʻana.

Keleawe i ʻōwili ʻia

E hoʻohele nā ​​ʻōwili keleawe i hoʻoheheʻe ʻia i ka annealed i kahi ʻōwili o ka ʻōwili keleawe ma o nā ʻōwili ʻelua, nāna e ʻōwili anu i ka pepa keleawe i ka mānoanoa i makemake ʻia. E ʻokoʻa ka ʻōʻino o ka pepa ʻōwili hopena ma muli o nā palena ʻōwili (wikiwiki, kaomi, a me nā mea ʻē aʻe).

Hiki i ka pepa hopena ke laumania loa, a ʻike ʻia nā kaha ma luna o ka ʻili o ka pepa keleawe i ʻōwili ʻia. Hōʻike nā kiʻi ma lalo nei i kahi hoʻohālikelike ma waena o kahi pepa keleawe i electrodeposited a me kahi pepa i ʻōwili ʻia.

Hoʻohālikelike ʻana o ka pepa keleawe PCB

Hoʻohālikelike ʻia o nā foil electrodeposited vs. rolled-annealed.
Keleawe Haʻahaʻa
ʻAʻole pono kēia he ʻano pepa keleawe āu e hana ai me kahi kaʻina hana ʻē aʻe. ʻO ke keleawe haʻahaʻa he keleawe electrodeposited i mālama ʻia a hoʻololi ʻia me kahi kaʻina hana micro-roughening e hāʻawi i ka roughness haʻahaʻa loa me ka roughening lawa no ka hoʻopili ʻana i ka substrate. ʻO nā kaʻina hana no ka hana ʻana i kēia mau pepa keleawe he mea ponoʻī ia. Hoʻokaʻawale pinepine ʻia kēia mau pepa i ka ultra-low profile (ULP), very low profile (VLP), a me ka low-profile wale nō (LP, ma kahi o 1 micron average roughness).

Nā ʻatikala pili:

No ke aha i hoʻohana ʻia ai ke keleawe foil i ka hana ʻana o PCB?

ʻO ka pepa kini keleawe i hoʻohana ʻia ma ka Papa Kaapuni i paʻi ʻia