Ua lilo nāʻoihana PCB i nā manawa he nui i hana nui i nā mea e hoʻomohala ai i nā mea e hāʻawi ai i ka nalowale haʻahaʻa haʻahaʻa. No ka wikiwiki kiʻekiʻe a me nā kiʻekiʻe kiʻekiʻe, pohō ka lulaʻana i ka papa hōʻailona papani a me nā hōʻailona extort eʻikeʻia i nā anaʻole eʻikeʻia ma TDR i nā ana helu tdr. Ke hoʻolālā nei mākou i kahi papa circuit i paʻiʻia a hoʻomohala i nā circaits e hana ana i nā mea kiʻekiʻe loa, e hoʻowalewaleʻia e koho i nā koho balota e hana ai.

ʻOiai heʻoiaʻiʻo ia e hana i ka maikaʻi o ka copper paʻakikī i hana hou i ka hoʻokaʻawaleʻana a me nā pohō, pehea ka maikaʻi o kāu copper copper e pono ai? Aia kekahi mauʻano maʻalahi e hiki ai iāʻoe ke hoʻohana i ka lanakilaʻana i nā pohoʻole me kaʻole e koho i nā keleawe ultra-spevan no kēlā me kēia hoʻolālā? E nānā mākou i kēia mau helu i kēiaʻatikala, e like me kāu eʻimi ai inā e hoʻomakaʻoe e kūʻai no ka kūʻaiʻana no PCB Stackpup.

Nāʻano oʻO ka Fopper Coop Copper

Maʻamau ke kamaʻilioʻana e pili ana i ke keleawe ma nā mea kūʻai pcb,ʻaʻole mākou e kamaʻilio e pili ana i keʻano keleawe, ke kamaʻilio wale nei mākou e pili ana i konaʻano. ʻO nā hana koho balotaʻokoʻa e hana ai i nā kiʻiʻoniʻoni me nā waiwai paʻakikī'ē aʻe, hiki ke hoʻomaopopoʻia i kahi kiʻi kiʻi uila (sem) kiʻi. Ināʻoe e hele ana e hana i nā ala kiʻekiʻe (maʻamau 5 ghz wifi a i luna) a iʻole ke nānāʻana i keʻano keleawe

Eia nō hoʻi, e hōʻoia i kaʻike i keʻano o nā waiwai o DK i kahi datasheet. E nānā i kēia kūkākūkā Poldcast me John Coonrod mai Rogers e aʻo hou e pili ana i nā kiko'ī DK. Me kēlā me ka noʻonoʻo, e nānā i kekahi o nāʻano likeʻole o ka foprops copper fopper foil.

ElectrodePospid

Ma kēia kaʻina hana,ʻo ka pahu pahu ka shun ma o kahi hopena electrolytic, a me kahiʻano electrodeposiketion e hoʻohanaʻia e "ulu" i ka pahu pahu. E like me ka pahu pahu, e neʻe mālie ana ke kiʻi o ke kiʻi kiʻi kiʻi i kahi kaʻa, e hāʻawi ana i kahi'āpana copper e hiki ke hoʻopiliʻia ma hope. E like me kaʻaoʻao o ka pahu o ke keleawe e hoʻokūkū i ka paʻakikī o ka pahu,ʻoiaiʻo kaʻaoʻao i hōʻikeʻia e nui ai.

Electrodepospospospospospospsad PCB Copper Foil

ʻO ka hana keleawe uila uila.
I mea e hoʻohanaʻia ai ma kahi kaʻina hana PCB maʻamau ʻO ke koena Copper i hōʻikeʻia (Drumʻaoʻao) e pono ai e hana i keʻano o ka chectically (e like me ka mea ma kahi o ka plasma clack clad clad clad clad clad clad clad clad E hōʻoia kēia e hiki ke hoʻopaʻaʻia i ka payter e hiki mai ana ma ka PCB Stackup.

ʻO nā koho balota i mālamaʻia

ʻAʻole maopopo iaʻu i ka'ōlelo maikaʻi loa e hoʻopuni ana i nāʻano likeʻole o nāʻano likeʻoleNā pāpale keleawe, no laila ke poʻo aʻe i luna. ʻO kēia mau mea kūʻai keleawe maikaʻi loa i kaulana loa e like me keʻano o nā mea i hanaʻia,ʻoiai nāʻano'ē aʻeʻelua e loaʻa (eʻike ma lalo).

E hoʻohana hou i nā hana i hoʻohanaʻia e hoʻohana ai i kahi hana ma kaʻaoʻao e pili ana i kaʻaoʻao o kaʻaoʻao ʻO kahi papa hana mālama wale nō he mea e hoʻowalewale ai i nā mea kanu i mea e hōʻiliʻili ai i ke keleawe, no laila e lilo ia i mea nui aku i kahi mea cexcectric. ʻO kēia mau hana hana i hanaʻia e like me ka barridation barrier e pale i ka corrosion. I ka manawa i hoʻohanaʻia ai kēia keleawe e hana ai i nā panel. ʻAʻole pono kaʻaoʻao i hōʻikeʻia i kahi ala hou aʻe ma mua o ka etching; E loaʻa iā ia kahi ikaika e hoʻopaʻaʻia ai i ka mea ma kahi o ka payter e hiki mai ana i ka papa pcb.

ʻEkolu mauʻano ma keʻano o ka paleʻana i ke kīleʻa i hanaʻia ma keʻano

ʻO ka maʻamau lōʻihi (HTE) Coprop Foll: He koho balota koho koho e pili ana i ka ipc-4562. Ua mālamaʻia ka helehelena i hōʻikeʻia me ka bolo o ka oxidation e pale ai i ka corrosion i ka wā o ka waihoʻana.
Ua hana pāluaʻia, i kēia kīleʻa keleawe, ua hoʻopiliʻia ka mālamaʻana i nāʻaoʻaoʻelua o ke kiʻi. ʻO kēia mau mea i kapaʻia i kapaʻiaʻo Drum-ʻaoʻao i mālamaʻia.
Resistive copper:ʻaʻole ia e helu maʻamau i ka heluʻana e like me ke keleawe i mālamaʻia. Hoʻohana kēia kīkī Coip i kahi papa metallic ma luna o kaʻaoʻao mate matte o ke keleawe,ʻo ia ka mea i makemakeʻia i ka pae i makemakeʻia.
ʻO ka noiʻana i ka palapala palapala palapala i loko o kēia mau mea kūʻai aku he pololei: Ua hoʻopiliʻia ka Foil ma kahi o nā mea kūʻai aku e pili ana i kahi kāleka kāleka kāleka.

ʻO ka Fopper Coop Copper

Ke kaʻina hana hana no nā papa keleawe. [Source: Pytel, Steven G., et al. "Ka ho'āʻoʻana o ka hoʻolālā keleawe a me nā hopena ma luna o ka hōʻailona hōʻailona." I nā makahiki he 2008 58 IEE, 2008.]
Me kēia mau kaʻina hana, loaʻa iāʻoe kahi mea e hiki ke maʻalahi maʻalahi i ka hana maʻamau ma ke kaʻina hana maʻamau me ka hoʻoili houʻana.

ʻO nā keleawe keleawe

ʻO nā bollad bollad-anneed aneneed e waiho i kahi'ōwili keleawe ma o kahi mau mea kūʻai aku ma waena o nā mea kūʻai aku, kahi e anu ana i ka pale keleawe i makemakeʻia. ʻO ka paʻakikī o ka pepa hopena hopena e hōʻikeʻia ma muli o nā paramterna o nā'ōwili

Hiki keʻike i ka'āpana hopena, aʻikeʻia nā striations ma luna o kaʻaoʻao o ke keleawe keleawe. Hōʻike nā kiʻi ma lalo o kahi hoʻohālikelike ma waena o kahi kohola keleawe keleawe a me kahi folled i kālaiʻia.

ʻO ka hoʻohālikelikeʻana o PCB Copper Folil

Hoʻohālikelike o nā electrodospospossited vs.
ʻO nā keleawe haʻahaʻa haʻahaʻa
ʻAʻole pono kēia i kahiʻano o ke keleawe keleawe āu e hana ai me kahi kaʻina'ē aʻe. ʻO ka keleawe haʻahaʻa haʻahaʻa haʻahaʻa i hanaʻia a hoʻololiʻia me kahi kaʻina micro-rhighening e hoʻolako ai i nāʻano haʻahaʻa haʻahaʻa no ka substration ʻO nā kaʻina hana no ka hanaʻana i kēia mau kapa keleawe he mea maʻamau maʻamau. Ua helu pinepineʻia kēia mau pūʻulu me ka pohō ultra-haʻahaʻa (ULP),ʻoi aku ka haʻahaʻa haʻahaʻa (vlp)

Nāʻatikala e pili ana:

No ke aha i hoʻohanaʻia ai ke kumukūʻai keleawe i hoʻohanaʻia ma ka hana PCB?

Ua hoʻohanaʻo Copper Foil i loko o ka papa i paʻiʻia