He aha kā mākou e manaʻo ai i ka Copper Foil ma ke kamaʻilio 5G i ka wā e hiki mai ana?

I nā lako kamaʻilio 5G e hiki mai ana, e hoʻonui hou ʻia ka hoʻohana ʻana o ka copper foil, ma mua o kēia mau wahi:

1. Nā PCB kiʻekiʻe (Paʻi Kaapuni Paʻi)

• Kapepa keleawe poho haahaa: Pono ka wikiwiki kiʻekiʻe a me ka latency haʻahaʻa o ke kamaʻilio 5G i nā ʻenehana hoʻouna hōʻailona kiʻekiʻe ma ka hoʻolālā papa kaapuni, e kau ana i nā koi kiʻekiʻe ma luna o ka conductivity a me ka paʻa. ʻO ka pahu keleawe liʻiliʻi liʻiliʻi, me kona ʻili maʻalahi, e hōʻemi i nā poho kūʻē ma muli o ka "hopena ʻili" i ka wā o ka hoʻouna ʻana i ka hōʻailona, ​​​​e mālama ana i ka pono o ka hōʻailona. E hoʻohana nui ʻia kēia pahu keleawe i nā PCB kiʻekiʻe no nā kahua kahua 5G a me nā antennas, ʻoi aku ka nui o nā mea e hana ana i nā alapine hawewe millimeter (ma luna o 30GHz).
• Kiʻekiʻe Precision Copper Foil: Pono nā antennas a me nā modula RF i nā polokalamu 5G i nā mea kikoʻī kiʻekiʻe e hoʻokō i ka hoʻouna ʻana i ka hōʻailona a me ka hana hoʻokipa. Ke kiʻekiʻe conductivity a me ka machinability opepa keleawee hana i kahi koho kūpono no nā antenna miniaturized, kiʻekiʻe-frequency. I loko o ka ʻenehana hawewe millimeter 5G, kahi i liʻiliʻi ai nā antenna a koi aku i ka ʻoi aku ka maikaʻi o ka hoʻouna ʻana i ka hōʻailona, ​​hiki i ka ultra-thin, kiʻekiʻe-precision copper foil ke hoʻemi nui i ka attenuation hōʻailona a hoʻonui i ka hana antenna.
• Mea Hoʻokele no nā Kaapuni Hiki: I ke au o 5G, ke hele nei nā mea kamaʻilio i ka māmā, ka lahilahi, a me ka maʻalahi, e alakaʻi ana i ka hoʻohana nui ʻana o nā FPC i nā kelepona, nā mea hiki ke hoʻohana ʻia, a me nā ʻōkuhi home akamai. ʻO Copper Foil, me kona maʻalahi maikaʻi, conductivity, a me ke kūpaʻa luhi, he mea koʻikoʻi koʻikoʻi i ka hana FPC, e kōkua ana i nā kaapuni e hoʻokō i nā pilina kūpono a me ka hoʻouna ʻana i nā hōʻailona ʻoiai e hālāwai ana i nā koi uea 3D paʻakikī.
• ʻO ka Pepa Copper Ultra-Thin no nā PCB HDI he nui: He mea nui ka ʻenehana HDI no ka miniaturization a me ka hana kiʻekiʻe o nā polokalamu 5G. Loaʻa i nā PCB HDI ke kiʻekiʻe kiʻekiʻe o ke kaapuni a me nā helu hoʻoili hōʻailona ma o nā uwea ʻoi aku ka maikaʻi a me nā lua liʻiliʻi. ʻO ke ʻano o ka ultra-thin copper foil (e like me 9μm a i ʻole thinner) e kōkua i ka hōʻemi ʻana i ka mānoanoa o ka papa, e hoʻonui i ka wikiwiki o ka hoʻouna ʻana i nā hōʻailona, ​​​​a e hōʻemi i ka pilikia o ka crosstalk hōʻailona. E hoʻohana nui ʻia kēlā ʻano kala keleawe ultra-thin i 5G smartphones, base station, a me nā mea ala.
• Kiekie-Efficiency Thermal Dissipation Copper Foil: Hoʻopuka nā mea 5G i ka wela nui i ka wā o ka hana, ʻoi aku ka nui o ka lawelawe ʻana i nā hōʻailona kiʻekiʻe a me nā puke ʻikepili nui, kahi e koi ai i ka hoʻokele wela. Hiki ke hoʻohana ʻia ke keleawe keleawe, me kāna conductivity thermal maikaʻi loa, i loko o nā hale wela o nā mea 5G, e like me nā ʻāpana conductive thermal, nā kiʻi ʻoniʻoni, a i ʻole nā ​​​​papa adhesive thermal, e kōkua ana i ka hoʻololi koke ʻana i ka wela mai ke kumu wela i nā mea wela a i ʻole nā ​​​​mea ʻē aʻe. hoʻonui i ka paʻa a me ka ola lōʻihi.
• Noi ma LTCC Modules: Ma nā lako kamaʻilio 5G, hoʻohana nui ʻia ka ʻenehana LTCC i nā modula mua-hope RF, nā kānana, a me nā antenna arrays.Pepa keleawe, me kona conductivity maikaʻi loa, resistivity haʻahaʻa, a me ka maʻalahi o ka hana ʻana, hoʻohana pinepine ʻia ma ke ʻano he conductive layer material i nā modules LTCC, ʻoi aku ka nui o nā hiʻohiʻona hoʻoili hōʻailona kiʻekiʻe. Eia kekahi, hiki ke uhi ʻia ka pahu keleawe me nā mea anti-oxidation e hoʻomaikaʻi i kona kūpaʻa a me ka hilinaʻi i ka wā o ke kaʻina sintering LTCC.
• Pepa keleawe no na kaapuni radar millimeter-wave: Loaʻa i ka millimeter-wave radar nā noi nui i ka wā 5G, me ka hoʻokele autonomous a me ka palekana naʻauao. Pono kēia mau radar e hana ma nā alapine kiʻekiʻe loa (ma waena o 24GHz a me 77GHz).Pepa keleawehiki ke hoʻohana ʻia e hana i nā papa kaapuni RF a me nā modula antenna i nā ʻōnaehana radar, e hāʻawi ana i ka hōʻailona hōʻailona maikaʻi loa a me ka hana hoʻouna.

2. Nā Antenna Miniature a me nā Module RF

3. Nā Papa Kaapuni Paʻi Paʻi ʻia (FPC)

4. ʻIkepili Kiʻekiʻe-Density Interconnect (HDI).

5. Hooponopono wela

6. ʻO ka ʻenehana Packaging Co-fired Temperature (LTCC).

7. Nā Pūnaehana Radar Millimeter-Hale

Ma ke ʻano holoʻokoʻa, ʻoi aku ka laulā a hohonu ka hoʻohana ʻana o ka copper foil i nā lako kamaʻilio 5G e hiki mai ana. Mai ka hoʻouna ʻana i ka hōʻailona kiʻekiʻe a me ka hana ʻana o ka papa kaapuni kiʻekiʻe a hiki i ka hoʻokele wela a me nā ʻenehana paʻa, ʻo kāna mau waiwai multifunctional a me kāna hana koʻikoʻi e hāʻawi i ke kākoʻo koʻikoʻi no ka hana paʻa a me ka maikaʻi o nā polokalamu 5G.