Pepa kini keleawe no nā Papa Kaapuni Paʻi (PCB)

Ua hoʻohana nui ʻia nā papa kaapuni paʻi (PCB) i ke ola o kēlā me kēia lā, a me ka hoʻonui ʻana i ka modernization, aia nā papa kaapuni ma nā wahi āpau o ko mākou ola. I ka manawa like, i ka piʻi ʻana o nā koi no nā huahana uila, ua lilo ka hoʻohui ʻana o nā papa kaapuni i mea paʻakikī. I mea e hoʻokō ai i nā pono o nā noi like ʻole, aia nā ʻano papa kaapuni hoʻokahi papa, nā papa kaapuni pālua papa, a me nā papa kaapuni multi-layer ma ka mākeke, kahi e kau ai i nā koi kiʻekiʻe ma ka substrate papa kaapuni, ke kila kila kila (CCL). Hiki i ka foil keleawe a CIVEN METAL ke hoʻokō i nā koi kumu āpau o nā CCL e kū nei. Loaʻa i ka foil no nā papa kaapuni paʻi nā waiwai conduction maikaʻi loa, ka maʻemaʻe kiʻekiʻe, ka pololei maikaʻi, ka liʻiliʻi o ka oxidation, ke kū'ē kemika maikaʻi, a me ka maʻalahi o ke kahakaha ʻana. I kēia manawa, i mea e hoʻokō ai i nā pono hana o nā mea kūʻai aku like ʻole, hiki iā CIVEN METAL ke ʻoki i nā foil keleawe i loko o ke ʻano pepa, hiki ke mālama i ka nui o nā kumukūʻai hana no nā mea kūʻai aku.