Palena keleawe no nā Papa Kaapuni Pai (PCB)

Ua hoʻohana nui ʻia nā papa kaapuni paʻi (PCB) i ke ola o kēlā me kēia lā, a me ka hoʻonui hou ʻana, aia nā papa kaapuni ma nā wahi āpau o ko mākou ola. I ka manawa like, i ka piʻi ʻana o nā koi no nā huahana uila, ʻoi aku ka paʻakikī o ka hoʻohui ʻana o nā papa kaapuni. No ka hoʻokō ʻana i nā pono o nā noi like ʻole, aia nā ʻano like ʻole o nā papa kaapuni hoʻokahi, nā papa kaapuni pālua, a me nā papa kaapuni multi-layer ma ka mākeke, e kau ana i nā koi kiʻekiʻe ma luna o ka papa kaapuni substrate, copper clad laminate (CCL). Hiki i ka CIVEN METAL ke kopa keleawe ke hoʻokō i nā koi kumu āpau o nā CCL e kū nei. ʻO ka foil no nā papa kaapuni i paʻi ʻia he mau waiwai conduction maikaʻi loa, maʻemaʻe kiʻekiʻe, pololei maikaʻi, liʻiliʻi o ka oxidation, kūpaʻa kemika maikaʻi, a maʻalahi etching. I kēia manawa, i mea e hoʻokō ai i nā pono hana o nā mea kūʻai aku like ʻole, hiki i ka CIVEN METAL ke ʻoki i nā foil keleawe i loko o ka pepa pepa, hiki ke mālama i ka nui o nā kumukūʻai hana no nā mea kūʻai aku.