Palena ED Copper Foils

Nā Kiʻi Hoʻohanohano ʻia ʻo ED Copper Foils

ʻO ka wehewehe pōkole:

ʻO ka pahu keleawe maʻamau STD i hana ʻia eCIVEN METAL ʻAʻole wale ka conductivity uila maikaʻi ma muli o ka maʻemaʻe kiʻekiʻe o ke keleawe, akā maʻalahi hoʻi e etch a hiki ke pale pono i nā hōʻailona electromagnetic a me ka hoʻopilikia ʻana i ka microwave.ʻO ke kaʻina hana electrolytic e hiki ai i ka laulā kiʻekiʻe o 1.2 mika a ʻoi aku paha, e ʻae ana i nā noi maʻalahi i nā ʻano ākea ākea.He ʻano palahalaha loa ke ʻano keleawe a hiki ke hoʻoheheʻe ʻia i nā mea ʻē aʻe.He kūpaʻa nō hoʻi ka pahu keleawe i ka oxidation kiʻekiʻe a me ka corrosion, kūpono ia no ka hoʻohana ʻana i nā wahi paʻakikī a i ʻole nā huahana me nā koi ola koʻikoʻi.

E hoʻouna i ka leka uila iā mākou Noi No Laana

Huahana Huahana

Hoʻolauna Huahana

ʻAʻole maikaʻi wale ka conductivity uila ma muli o ka maʻemaʻe kiʻekiʻe o ke keleawe, akā ua maʻalahi hoʻi ke kālai ʻia a hiki ke pale pono i nā hōʻailona electromagnetic a me ka interference microwave.ʻO ke kaʻina hana electrolytic e hiki ai i ka laulā kiʻekiʻe o 1.2 mika a ʻoi aku paha, e ʻae ana i nā noi maʻalahi i nā ʻano ākea ākea.He ʻano palahalaha loa ke ʻano keleawe a hiki ke hoʻoheheʻe ʻia i nā mea ʻē aʻe.He kūpaʻa nō hoʻi ka pahu keleawe i ka oxidation kiʻekiʻe a me ka corrosion, kūpono ia no ka hoʻohana ʻana i nā wahi paʻakikī a i ʻole nā huahana me nā koi ola koʻikoʻi.

Nā kikoʻī

Hiki iā CIVEN ke hāʻawi i ka 1/3oz-4oz (nominal mānoanoa 12μm -140μm) pale keleawe electrolytic foil me ka laulā kiʻekiʻe o 1290mm, a i ʻole nā ʻano kikoʻī like ʻole o ka pale electrolytic copper foil me ka mānoanoa o 12μm -140μm e like me nā koi o ka mea kūʻai aku me ka maikaʻi o ka huahana. nā koi o IPC-4562 maʻamau II a me III.

hana

ʻAʻole wale ia i nā waiwai kino maikaʻi loa o ka kristal maikaʻi equiaxial, haʻahaʻa haʻahaʻa, ikaika kiʻekiʻe a me ka elongation kiʻekiʻe, akā loaʻa nō hoʻi ke kūpaʻa maikaʻi o ka moisture, ke kūpaʻa kemika, ka thermal conductivity a me ke kūpaʻa UV, a kūpono no ka pale ʻana i ka hoʻopili ʻana me ka uila static a me ka hoʻopau ʻana i ka electromagnetic. nalu, etc.

Nā noi

He kūpono no ka automotive, uila uila, kamaʻilio, pūʻali koa, aerospace a me nā papa kaapuni kiʻekiʻe kiʻekiʻe, hana kiʻekiʻe-frequency papa hana, a me nā transformers, nā kelepona, kelepona kelepona, kamepiula, lāʻau lapaʻau, aerospace, pūʻali koa a me nā huahana uila ʻē aʻe.

Nā pono

1, Ma muli o ke kaʻina hana kūikawā o kā mākou roughening surface, hiki iā ia ke pale pono i ka haki ʻana o ka uila.
2、No ka mea, ʻo ka ʻano huaʻai o kā mākou huahana he equiaxed fine crystal spherical, hoʻopōkole ia i ka manawa o ka laina etching a hoʻomaikaʻi i ka pilikia o ka etching ʻaoʻao laina ʻole.
3, ʻoiai ka ikaika peel kiʻekiʻe, ʻaʻohe hoʻoili keleawe pauka, nā kiʻi kiʻi PCB hana hana.

Hana (GB/T5230-2000, IPC-4562-2000)

Hoʻokaʻawale		Unite	9μm	12μm	18μm	35μm	50μm	70μm	105μm
Cu maʻiʻo		%	≥99.8
Kaumaha ʻāpana		g/m²	80±3	107±3	153±5	283±7	440±8	585±10	875±15
Ikaika U'i	RT(23 ℃)	Kg/mm²	≥28
	HT(180 ℃)		≥15			≥18	≥20
ʻO ka lōʻihi	RT(23 ℃)	%	≥5.0		≥6.0	≥10
	HT(180 ℃)		≥6.0			≥8.0
ʻoʻoleʻa	ʻālohilohi(Ra)	μm	≤0.43
	Māmā(Rz)		≤3.5
Ikaika Peel	RT(23 ℃)	Kg/cm	≥0.77	≥0.8	≥0.9	≥1.0	≥1.0	≥1.5	≥2.0
Hoʻohaʻahaʻa ʻia o HCΦ(18%-1hr/25 ℃)		%	≤7.0
Hoʻololi kala (E-1.0hr/200 ℃)		%	Maikaʻi loa
Kunai e lana ana 290 ℃		Sec.	≥20
ʻO ke ʻano (Spot and copper powder)		----	ʻAʻohe
Pinhole		EA	ʻole
Ka hoʻomanawanui ʻana	Laulā	0~2mm	0~2mm
	Ka lōʻihi	----	----
Core		Mm/inihi	Aia loko 76mm/3 iniha

Nānā:1. ʻO ka waiwai Rz o ka ʻili nui o ka copper foil ka waiwai kūpaʻa hoʻāʻo, ʻaʻole ka waiwai i hoʻopaʻa ʻia.

2. ʻO ka ikaika Peel ka waiwai hōʻike papa FR-4 maʻamau (5 pepa o 7628PP).

3. ʻO ka manawa hōʻoia maikaʻi he 90 mau lā mai ka lā i loaʻa ai.

Mua: [RTF] Hoʻololi ʻia ʻo ED Copper Foil

Aʻe: Nā Foils Copper ED Mānoanoa Nui

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Līpī Copper Foil Hoʻopili