[RTF] Hoʻololi ʻia ʻo ED Copper Foil

ʻO ka wehewehe pōkole:

RTF, reverselapaʻau ʻiaelectrolytic copper foil he mea keleawe ia i hooleleia i na degere like ole ma na aoao elua.Hoʻoikaika kēia i ka ikaika peel o nā ʻaoʻao ʻelua o ka pahu keleawe, e maʻalahi ka hoʻohana ʻana ma ke ʻano he papa waena no ka hoʻopaʻa ʻana i nā mea ʻē aʻe.Eia kekahi, ʻo nā pae ʻokoʻa o ka lapaʻau ʻana ma nā ʻaoʻao ʻelua o ka pahu keleawe e maʻalahi ke kālai ʻana i ka ʻaoʻao ʻoi aku ka lahilahi o ka papa ʻākala.I ke kaʻina hana o ka papa kaapuni paʻi (PCB), ua hoʻohana ʻia ka ʻaoʻao i mālama ʻia o ke keleawe i ka mea dielectric.ʻOi aku ka paʻa o ka ʻaoʻao pahu i mālama ʻia ma mua o ka ʻaoʻao ʻē aʻe, kahi i hoʻopili nui ʻia i ka dielectric.ʻO kēia ka pono nui ma mua o ke keleawe electrolytic maʻamau.ʻAʻole pono ka ʻaoʻao matte i kahi hana mechanical a i ʻole kemika ma mua o ka hoʻohana ʻana i ka photoresist.Ua 'o'ole'a lawa e loa'a ka laminating maika'i e kū'ē i ka adhesion.


Huahana Huahana

Huahana Huahana

Hoʻolauna Huahana

ʻO RTF, hoʻohuli ʻia i ka electrolytic copper foil, he ʻāpana keleawe i hoʻopaʻa ʻia i nā degere like ʻole ma nā ʻaoʻao ʻelua.Hoʻoikaika kēia i ka ikaika peel o nā ʻaoʻao ʻelua o ka pahu keleawe, e maʻalahi ka hoʻohana ʻana ma ke ʻano he papa waena no ka hoʻopaʻa ʻana i nā mea ʻē aʻe.Eia kekahi, ʻo nā pae ʻokoʻa o ka lapaʻau ʻana ma nā ʻaoʻao ʻelua o ka pahu keleawe e maʻalahi ke kālai ʻana i ka ʻaoʻao ʻoi aku ka lahilahi o ka papa ʻākala.I ke kaʻina hana o ka papa kaapuni paʻi (PCB), ua hoʻohana ʻia ka ʻaoʻao i mālama ʻia o ke keleawe i ka mea dielectric.ʻOi aku ka paʻa o ka ʻaoʻao pahu i mālama ʻia ma mua o ka ʻaoʻao ʻē aʻe, kahi i hoʻopili nui ʻia i ka dielectric.ʻO kēia ka pono nui ma mua o ke keleawe electrolytic maʻamau.ʻAʻole pono ka ʻaoʻao matte i kahi hana mechanical a i ʻole kemika ma mua o ka hoʻohana ʻana i ka photoresist.Ua 'o'ole'a lawa e loa'a ka laminating maika'i e kū'ē i ka adhesion.

Nā kikoʻī

Hiki iā CIVEN ke hāʻawi i ka RTF electrolytic copper foil me ka mānoanoa nominal o 12 a 35µm a hiki i 1295mm laula.

hana

ʻO ka elongation wela kiʻekiʻe i hoʻohuli ʻia i mālama ʻia electrolytic copper foil i hoʻopaʻa ʻia i kahi kaʻina plating pololei e kāohi i ka nui o nā ʻōpū keleawe a puʻunaue like.Hiki i ka ʻili ʻālohilohi i hoʻohuli ʻia o ka ʻili keleawe ke hōʻemi nui i ka ʻawaʻawa o ka ʻōpala keleawe i kaomi pū ʻia a hāʻawi i ka ikaika peel lawa o ka ʻili keleawe.(E nana i ka Papa 1)

Nā noi

Hiki ke hoʻohana ʻia no nā huahana kiʻekiʻe a me nā laminates i loko, e like me nā kahua kahua 5G a me nā radar automotive a me nā mea hana ʻē aʻe.

Nā pono

ʻO ka ikaika paʻa maikaʻi, ka lamination multi-layer pololei, a me ka hana etching maikaʻi.Hoʻemi ia i ka hiki no ka pōkole pōkole a hoʻopōkole i ke kaʻina hana.

Papa 1. Hana

Hoʻokaʻawale

Unite

1/3OZ

(12μm)

1/2OZ

(18μm)

1OZ

(35μm)

Cu maʻiʻo

%

min.99.8

Kaumaha ʻāpana

g/m2

107±3

153±5

283±5

Ikaika U'i

RT(25 ℃)

Kg/mm2

min.28.0

HT(180 ℃)

min.15.0

min.15.0

min.18.0

ʻO ka lōʻihi

RT(25 ℃)

%

min.5.0

min.6.0

min.8.0

HT(180 ℃)

min.6.0

ʻoʻoleʻa

ʻālohilohi(Ra)

μm

max.0.6/4.0

max.0.7/5.0

max.0.8/6.0

Māmā(Rz)

max.0.6/4.0

max.0.7/5.0

max.0.8/6.0

Ikaika Peel

RT(23 ℃)

Kg/cm

min.1.1

min.1.2

min.1.5

Hoʻohaʻahaʻa ʻia o HCΦ(18%-1hr/25 ℃)

%

max.5.0

Hoʻololi kala (E-1.0hr/190 ℃)

%

ʻAʻohe

Kunai e lana ana 290 ℃

Sec.

max.20

Pinhole

EA

ʻole

Preperg

----

FR-4

Nānā:1. ʻO ka waiwai Rz o ka ʻili nui o ka copper foil ka waiwai kūpaʻa hoʻāʻo, ʻaʻole ka waiwai i hoʻopaʻa ʻia.

2. ʻO ka ikaika Peel ka waiwai hōʻike papa FR-4 maʻamau (5 pepa o 7628PP).

3. ʻO ka manawa hōʻoia maikaʻi he 90 mau lā mai ka lā i loaʻa ai.


  • Mua:
  • Aʻe:

  • E kākau i kāu leka ma aneʻi a hoʻouna mai iā mākou