[VLP] Haʻahaʻa Loa ED Copper Foil

ʻO ka wehewehe pōkole:

VLP, loalow profile electrolytic copper foil i hanaia eCIVEN METAL loaʻa nā ʻano o haahaa ʻoʻoleʻa a me ka ikaika peel kiʻekiʻe.ʻO ka pahu keleawe i hana ʻia e ke kaʻina electrolysis nā mea maikaʻi o ka maʻemaʻe kiʻekiʻe, nā haumia haʻahaʻa, ka ʻili maʻemaʻe, ke ʻano o ka papa pālahalaha, a me ka laulā nui.Hiki ke hoʻopili maikaʻi ʻia ka foil keleawe electrolytic me nā mea ʻē aʻe ma hope o ka paʻakikī ʻana ma kekahi ʻaoʻao, a ʻaʻole maʻalahi ke ʻili.


Huahana Huahana

Huahana Huahana

Hoʻolauna Huahana

ʻO VLP, haʻahaʻa haʻahaʻa electrolytic copper foil i hana ʻia e CIVEN METAL nā hiʻohiʻona o ka haʻahaʻa haʻahaʻa a me ka ikaika peel kiʻekiʻe.ʻO ka pahu keleawe i hana ʻia e ke kaʻina electrolysis nā mea maikaʻi o ka maʻemaʻe kiʻekiʻe, nā haumia haʻahaʻa, ka ʻili maʻemaʻe, ke ʻano o ka papa pālahalaha, a me ka laulā nui.Hiki ke hoʻopili maikaʻi ʻia ka foil keleawe electrolytic me nā mea ʻē aʻe ma hope o ka paʻakikī ʻana ma kekahi ʻaoʻao, a ʻaʻole maʻalahi ke ʻili.

Nā kikoʻī

Hiki iā CIVEN ke hāʻawi i ka ultra-low profile high temperature ductile electrolytic copper foil (VLP) mai 1/4oz a i 3oz (nominal mānoanoa 9μm a 105μm), a ʻo ka nui o ka huahana he 1295mm x 1295mm sheet copper foil.

hana

CIVEN hāʻawi i ka ultra-thick electrolytic copper foil me nā waiwai kino maikaʻi o ka equiaxial fine crystal, haʻahaʻa haʻahaʻa, ikaika kiʻekiʻe a me ka elongation kiʻekiʻe.(E nana i ka Papa 1)

Nā noi

E pili ana i ka hana ʻana i nā papa kaapuni mana kiʻekiʻe a me nā papa kiʻekiʻe no ka automotive, mana uila, kamaʻilio, pūʻali koa a me ka aerospace.

Nā hiʻohiʻona

Hoʻohālikelike me nā huahana like ʻole.
1. The grain structure of our VLP electrolytic copper foil is equiaxed fine crystal spherical;ʻoiai he kolamu a lōʻihi ke ʻano o nā huahana like ʻole.
2. Electrolytic copper foil he ultra-low profile, 3oz copper foil gross surface Rz ≤ 3.5µm;ʻoiai ʻo nā huahana ʻē aʻe he ʻano maʻamau, 3oz copper foil gross surface Rz > 3.5µm.

Nā pono

1. No ka mea he ultra-low profile kā mākou huahana, hoʻoponopono ia i ka pilikia o ka laina pōkole pōkole ma muli o ka nui o ka roughness o ka pahu keleawe mānoanoa maʻamau a me ka maʻalahi o ka komo ʻana o ka pepa insulation lahilahi e ka "niho wolf" i ka wā e kaomi ai i ka. panel ʻaoʻao ʻelua.
2. No ka mea, ua hoʻohālikelike ʻia ke ʻano o ka palaoa o kā mākou huahana i ka spherical aniani maikaʻi, e hoʻopōkole i ka manawa o ka etching laina a hoʻomaikaʻi i ka pilikia o ka etching ʻaoʻao laina ʻole.
3, ʻoiai ke loaʻa nei ka ikaika peel kiʻekiʻe, ʻaʻohe hoʻoili keleawe pauka, nā kiʻi kiʻi kiʻi PCB hana hana.

Hana (GB/T5230-2000, IPC-4562-2000)

Hoʻokaʻawale

Unite

9μm

12μm

18μm

35μm

70μm

105μm

Cu Maʻiʻo

%

≥99.8

Kaumaha ʻāpana

g/m2

80±3

107±3

153±5

283±7

585±10

875±15

Ikaika U'i

RT(23 ℃)

Kg/mm2

≥28

HT(180 ℃)

≥15

≥18

≥20

ʻO ka lōʻihi

RT(23 ℃)

%

≥5.0

≥6.0

≥10

HT(180 ℃)

≥6.0

≥8.0

ʻoʻoleʻa

ʻālohilohi(Ra)

μm

≤0.43

Māmā(Rz)

≤3.5

Ikaika Peel

RT(23 ℃)

Kg/cm

≥0.77

≥0.8

≥0.9

≥1.0

≥1.5

≥2.0

Hoʻohaʻahaʻa ʻia o HCΦ(18%-1hr/25 ℃)

%

≤7.0

Hoʻololi kala (E-1.0hr/200 ℃)

%

Maikaʻi loa

Kunai e lana ana 290 ℃

Sec.

≥20

ʻO ke ʻano (Spot and copper powder)

----

ʻAʻohe

Pinhole

EA

ʻole

Ka hoʻomanawanui ʻana

Laulā

mm

0~2mm

Ka lōʻihi

mm

----

Core

Mm/inihi

Aia loko 79mm/3 iniha

Nānā:1. ʻO ka waiwai Rz o ka ʻili nui o ka copper foil ka waiwai kūpaʻa hoʻāʻo, ʻaʻole ka waiwai i hoʻopaʻa ʻia.

2. ʻO ka ikaika Peel ka waiwai hōʻike papa FR-4 maʻamau (5 pepa o 7628PP).

3. ʻO ka manawa hōʻoia maikaʻi he 90 mau lā mai ka lā i loaʻa ai.


  • Mua:
  • Aʻe:

  • E kākau i kāu leka ma aneʻi a hoʻouna mai iā mākou