Ka Hana Hana Copper Foil ma Hale Hana

Me ka hoʻopiʻi kiʻekiʻe i ka nui o nā huahana ʻoihana, ʻike ʻia ke keleawe he mea maʻalahi loa.

Hoʻopuka ʻia nā pahu keleawe e nā kaʻina hana kikoʻī loa i loko o ka wili foil me ka ʻōwili wela a me ke anu.

Me ka aluminika, hoʻohana nui ʻia ke keleawe i nā huahana ʻoihana ma ke ʻano he mea nui loa i waena o nā mea metala non-ferrous. ʻOi aku i nā makahiki i hala iho nei, ke piʻi nei ke koi no ka copper foil no nā huahana uila e pili ana i nā kelepona paʻalima, nā kāmela kikohoʻe, a me nā polokalamu IT.

Ka hana ʻana i ka pepa

Hoʻopuka ʻia nā pahu keleawe lahilahi e ka electrodeposition a i ʻole ka ʻōwili ʻana. No ka electrodeposition, pono e hoʻoheheʻe ʻia ke keleawe kiʻekiʻe i loko o kahi waikawa e hana ai i kahi electrolyte keleawe. Hoʻomoʻi ʻia kēia hāleʻa electrolyte i loko o nā pahu i hoʻopaʻa ʻia i loko o nā pahu i hoʻopaʻa ʻia i ka uila. Ma luna o kēia mau pahu i hoʻopaʻa ʻia kahi kiʻi keleawe keleawe. Ua kapa ʻia kēia kaʻina hana he plating.

I loko o kahi kaʻina hana keleawe electrodeposited, waiho ʻia ka pahu keleawe ma luna o kahi pahu pahu titanium mai kahi hopena keleawe kahi i hoʻopili ʻia ai i kahi puna uila DC. Hoʻopili ʻia ka cathode i ka pahu a hoʻokomo ʻia ka anode i loko o ka solution electrolyte keleawe. Ke hoʻohana ʻia ke kahua uila, waiho ʻia ke keleawe ma luna o ka pahu i kona kaʻa ʻana me ka wikiwiki loa. ʻO ka ʻili keleawe ma ka ʻaoʻao pahu he laumania a ʻo ka ʻaoʻao ʻē aʻe he ʻōkeke. ʻOi aku ka lohi o ka pahu pahu, ʻoi aku ka mānoanoa o ke keleawe a ʻoi aku ka ʻoi aku. Hoʻopili ʻia ke keleawe a hōʻiliʻili ʻia ma ka ʻili cathode o ka pahu titanium. ʻO ka ʻaoʻao matte a me ka pahu pahu o ka pahu keleawe e hele i nā pōʻai lapaʻau like ʻole i hiki ke kūpono ke keleawe no ka hana PCB. Hoʻonui nā lāʻau lapaʻau i ka pili ʻana ma waena o ke keleawe a me ka dielectric interlayer i ka wā o ke kaʻina hana lamination copper clad. ʻO kekahi pōmaikaʻi ʻē aʻe o nā lāʻau lapaʻau ʻo ka hana ʻana ma ke ʻano he anti-tarnish agents ma o ka hoʻolohi ʻana i ka oxidation o ke keleawe.

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Kiʻi 1: Electrodeposited Copper Manufacturing ProcessFigure 2 hōʻike i nā kaʻina hana o nā huahana keleawe i ʻōwili ʻia. Hoʻokaʻawale ʻia nā mea hana ʻōwili i ʻekolu ʻano; ʻo ia hoʻi, nā wili wela, nā wili anu, a me nā wili pepa.

Hoʻokumu ʻia nā ʻili o nā ʻāpana lahilahi a hoʻomaʻamaʻa ʻia i ke kemika a me ka mīkini a hiki i ka hana ʻana i ko lākou ʻano hope. Hāʻawi ʻia kahi hiʻohiʻona hoʻolālā o ke kaʻina ʻōwili o nā pahu keleawe ma ke Kiʻi 2. ʻO kahi poloka keleawe i hoʻolei ʻia (nā ana kokoke: 5mx1mx130mm) ua wela a hiki i 750 ° C. A laila, ʻōwili ʻia me ka wela ma nā ʻanuʻu he nui a hiki i ka 1/10 o kona mānoanoa kumu. Ma mua o ka ʻōwili anu mua ʻana, lawe ʻia nā unahi i loaʻa mai ka mālama wela ma ka wili ʻana. Ma ke kaʻina ʻōwili anuanu e hoʻemi ʻia ka mānoanoa ma kahi o 4 mm a ua hoʻokumu ʻia nā ʻāpana i nā coils. Hoʻomaluʻia ke kaʻina hana i mea e lōʻihi wale ai ka mea aʻaʻole e hoʻololi i kona laulā. No ka mea, ʻaʻole hiki ke hana hou ʻia nā ʻili ma kēia mokuʻāina (ua paʻakikī loa ka mea hana) ua hoʻomaʻamaʻa ʻia lākou i ka wela a hoʻomehana ʻia a hiki i 550 ° C.


Ka manawa hoʻouna: ʻAukake-13-2021