RA Copper Foil
Pepa keleawe i ʻōwili ʻia
ʻO ka mea metala me ka mea keleawe kiʻekiʻe loa i kapa ʻia he keleawe maʻemaʻe. Ua ʻike nui ʻia ʻo iaʻulaʻula keleawe no kona ili puka maiʻulaʻula-ʻulaʻula. Loaʻa i ke keleawe ke kūlana kiʻekiʻe o ka maʻalahi a me ka ductility. Loaʻa iā ia ka maikaʻi o ka uila a me ka thermal conductivity. ʻO ka pahu keleawe i hana ʻia eCIVEN METAL ʻAʻole wale ka maʻemaʻe kiʻekiʻe a me nā ʻano haumia haʻahaʻa, akā loaʻa pū kekahipahee ka hoʻopau ʻana o ka ʻili, ke ʻano pepa pālahalaha a me ke ʻano like ʻole. Ua kūpono lākou no ka hoʻohana ʻana e like me nā mea pale uila, thermal a me electromagnetic. ʻO ka pepa keleawe i ʻōwili ʻia maiCIVEN METAL He mea machinable a maʻalahi hoʻi e hana a laminate. Ma muli o ka pōʻaihale kūkulu ʻO ka pahu keleawe i'ōwiliʻia, hiki ke hoʻomaluʻia ke kūlana palupalu a paʻakikī e ke kaʻina hana annealing, eʻoi aku ka maikaʻi no kahi ākea nā noi.Hiki i ka CIVEN METAL ke hana i nā pepa keleawe i nā mānoanoa like ʻole a me nā laula e like me nā koi o ka mea kūʻai aku, pēlā e hōʻemi ai i nā kumukūʻai hana a me ka hoʻomaikaʻi ʻana i ka hana pono.
| Mea Kumu | C11000 keleawe, Cu > 99.90% |
| Mānoanoa | 0.01mm-0.15mm (0.0004 iniha~0.006 iniha) |
| Laulā laula | 4mm-400mm(0.16inihi~16inihi) |
| Ka huhū | Paʻa, Hapa Paʻa, Paʻalu |
| Palapala noi | Transformer, Copper Flexible Connector, CCL, FCCL, PCB, Geothermal Film, Construction, Decor etc. |
| GB | ALLOY NO. | SIZE (mm) | ||||
| (ISO) | (ASMT) | (JIS) | (BIS) | (DIN) | ||
| T2 | Cu-ETP | C11000 | C1100 | C101 | R-Cu57 | Mānoanoa: 0.01-0.15/Max Laulā: 400 |
| TU2 | Cu-OF | C10200 | C1020 | Cu-OFC | O-Cu | |
Na Waiwai Mechanical
| Ka huhū | JIS Makana | Ikaika U'i Rm/N/mm 2 | Elongation A50/% | HV paʻakikī |
| M | O | 220~275 | ≥ 15 | 40～60 |
| Y2 | 1/4H | 240~300 | ≥ 9 | 55～85 |
| Y | H | 330~450 | - | 80～150 |
Nānā: Hiki iā mākou ke hāʻawi i nā huahana me nā waiwai ʻē aʻe e like me nā koi o nā mea kūʻai aku.
Na Waiwai Kino
| ʻO ka mānoanoa | 8.9g/cm3 |
| Ka hoʻoili uila (20°C) | min 90%IACS no ka annealed i ka huhūmin 80%IACS no ka ʻōwili ʻia i ka huhū |
| Ka hoʻoheheʻe wela (20°C) | 390W/(m°C) |
| Modulus elastic | 118000N/m |
| ʻO ka mahana palupalu | ≥380°C |
Ka nui a me ka hoʻomanawanui (mm)
| mānoanoa | Mānoanoa hoʻomanawanui | Laulā | ʻAʻohe ākea |
| 0.01~0.015 | ± 0.002 | 4~250 | ± 0.1 |
| > 0.018~0.10 | ± 0.003 | 4~400 | |
| > 0.10~0.15 | ± 0.005 | 4~400 |
Loaʻa nā kikoʻī (mm)
| mānoanoa | Laulā | Ka huhū |
| 0.01~0.015 | 4～250 | O,H |
| > 0.018~0.10 | 4～400 | O,H |
| > 0.10~0.15 | 4～400 | O,1/2H,H |
Lawe ʻia (mea hou loa)
| Nā lāhui | Kūlana No. | inoa maʻamau |
| Kina | GB/T2059--2000 | KE KUMU AINA O KINA |
| Iapana | JIS H3100 :2000 | NA PALAPALA, NA PAPA A ME NA KAA |
| USA | ASTM B36/B 36M -01 | NĀ HOʻOPIʻI NO KE KUMU, PALAPALA, KA PALAPALA, KA PALAPALA A ME KA PALA |
| Kelemānia | DIN-EN 1652:1997 | PALAPALA, PALAPALA, PALAPALA, A ME NA POE NO KA HANA MAU. |
| DIN-EN 1758 :1997 | KELE A ME KE KOPA ALLOY HANA NO NA LEADFRAMES | |
| SEMI | SEMI G4-0302 | NĀ HOʻOPIʻI NO NA MATERIALS CIRCUIT LEADFRAME INTERGRATED INTERGRATED CIRCUIT LEADFRAME MATERIALS I PRODUCTION OF THE STAMPED LEADFRAMES. |
