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ED Copper Foils no FPC

ʻO ka wehewehe pōkole:

FCF, hikiwawepepa keleawe ua hoʻomohala kūikawā a hana ʻia no ka ʻoihana FPC (FCCL). ʻOi aku ka maikaʻi o kēia electrolytic copper foil, haʻahaʻa haʻahaʻa a ʻoi aku ka ikaika o ka peel ma mua o'ē aʻe pepa keleawes. I ka manawa like, ʻoi aku ka maikaʻi o ka hoʻopau ʻana o ka ʻili a me ka maikaʻi o ke keleawe keleawe a ʻoi aku ka maikaʻi o ka pale ʻanakekahiʻoi aku ka maikaʻi ma mua o nā huahana copper foil like. No ka mea ua hoʻokumu ʻia kēia pahu keleawe ma ke kaʻina hana electrolytic, ʻaʻole i loko o ka momona, kahi e maʻalahi ai ka hui ʻana me nā mea TPI i nā wela kiʻekiʻe.


Huahana Huahana

Huahana Huahana

Hoʻolauna Huahana

FCF, hikiwawepepa keleawe ua hoʻomohala kūikawā a hana ʻia no ka ʻoihana FPC (FCCL). ʻOi aku ka maikaʻi o kēia electrolytic copper foil, haʻahaʻa haʻahaʻa a ʻoi aku ka ikaika o ka peel ma mua o'ē aʻe pepa keleawes. I ka manawa like, ʻoi aku ka maikaʻi o ka hoʻopau ʻana o ka ʻili a me ka maikaʻi o ke keleawe keleawe a ʻoi aku ka maikaʻi o ka pale ʻanakekahiʻoi aku ka maikaʻi ma mua o nā huahana copper foil like. No ka mea ua hoʻokumu ʻia kēia pahu keleawe ma ke kaʻina hana electrolytic, ʻaʻole i loko o ka momona, kahi e maʻalahi ai ka hui ʻana me nā mea TPI i nā wela kiʻekiʻe.

Launa Ana:

mānoanoa:9µm35µm

hana

He ʻeleʻele a ʻulaʻula paha ka ʻili o ka huahana, he haʻahaʻa haʻahaʻa o ka ʻili.

Nā noi

ʻO ka Laminate Copper Clad Laminate (FCCL), FPC Kaapuni maikaʻi, ke kiʻi ʻoniʻoni ʻoniʻoni aniani i uhi ʻia.

Nā hiʻohiʻona:

Kiʻekiʻe kiʻekiʻe, kiʻekiʻe bending kū'ē a me ka maikai etching hana.

Microstructure:

ED Copper Foils no FPC3

SEM

ED Copper Foils no FPC2

SEM (Ma mua o ka mālama ʻana i ka ʻili)

ED Copper Foils no FPC1

SEM (ʻaoʻao ʻālohilohi ma hope o ka mālama ʻana)

Papa 1- Hana (GB/T5230-2000, IPC-4562-2000):

Hoʻokaʻawale

Unite

9μm

12μm

18μm

35μm

Cu Maʻiʻo

%

≥99.8

Kaumaha ʻāpana

g/m2

80±3

107±3

153±5

283±7

Ikaika U'i

RT(23 ℃)

Kg/mm2

≥28

HT(180 ℃)

≥15

≥15

≥15

≥18

ʻO ka elongation

RT(23 ℃)

%

≥5.0

≥5.0

≥6.0

≥10

HT(180 ℃)

≥6.0

≥6.0

≥8.0

≥8.0

ʻoʻoleʻa

ʻālohilohi(Ra)

μm

≤0.43

Māmā(Rz)

≤2.5

Ikaika Peel

RT(23 ℃)

Kg/cm

≥0.77

≥0.8

≥0.8

≥0.8

Hoʻohaʻahaʻa ʻia o HCΦ(18%-1hr/25 ℃)

%

≤7.0

Hoʻololi kala (E-1.0hr/200 ℃)

%

Maikaʻi loa

Kunai e lana ana 290 ℃

Sec.

≥20

ʻO ke ʻano (Spot and copper powder)

----

ʻAʻohe

Pinhole

EA

ʻole

Ka hoʻomanawanui ʻana

Laulā

mm

0~2mm

Ka lōʻihi

mm

----

Core

Mm/inihi

Aia loko 79mm/3 iniha

'Ōlelo Aʻo: 1. Copper foil oxidation kū'ē i ka hana a me ka ili ili kuhikuhi hiki ke kūkākūkā.

2. Aia ka papa kuhikuhi hana i kā mākou ʻano hoʻāʻo.

3. ʻO ka manawa hōʻoia maikaʻi he 90 mau lā mai ka lā i loaʻa ai.


  • Mua:
  • Aʻe:

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