< kiʻekiʻe kiʻekiʻe="1" laulā="1" kaila="hōʻike:ʻaʻohe" src="https://www.facebook.com/tr?id=1663378561090394&ev=PageView&noscript=1" /> ʻO nā Foil Keleawe ED maikaʻi loa no ka mea hana a me ka hale hana FPC | Civen

Nā Pepa Keleawe ED no FPC

Wehewehe Pōkole:

FCF, maʻalahipepa keleawe ua hoʻomohala kūikawā ʻia a hana ʻia no ka ʻoihana FPC (FCCL). ʻOi aku ka maikaʻi o ka ductility o kēia pepa keleawe electrolytic, haʻahaʻa ka roughness a ʻoi aku ka maikaʻi o ka ikaika peel ma mua okekahi pepa keleawesI ka manawa like, ʻoi aku ka maikaʻi o ka hoʻopau ʻana o ka ʻili a me ka maikaʻi o ka pepa keleawe a ʻoi aku ka pale ʻana o ka pelu ʻanapū kekahiʻoi aku ka maikaʻi ma mua o nā huahana pepa keleawe like. ʻOiai ua hoʻokumu ʻia kēia pepa keleawe ma ke kaʻina hana electrolytic, ʻaʻohe ona momona, kahi e maʻalahi ai ka hui pū ʻana me nā mea TPI i nā mahana kiʻekiʻe.


Nā kikoʻī huahana

Nā Lepili Huahana

Hoʻolauna Huahana

FCF, maʻalahipepa keleawe ua hoʻomohala kūikawā ʻia a hana ʻia no ka ʻoihana FPC (FCCL). ʻOi aku ka maikaʻi o ka ductility o kēia pepa keleawe electrolytic, haʻahaʻa ka roughness a ʻoi aku ka maikaʻi o ka ikaika peel ma mua okekahi pepa keleawesI ka manawa like, ʻoi aku ka maikaʻi o ka hoʻopau ʻana o ka ʻili a me ka maikaʻi o ka pepa keleawe a ʻoi aku ka pale ʻana o ka pelu ʻanapū kekahiʻoi aku ka maikaʻi ma mua o nā huahana pepa keleawe like. ʻOiai ua hoʻokumu ʻia kēia pepa keleawe ma ke kaʻina hana electrolytic, ʻaʻohe ona momona, kahi e maʻalahi ai ka hui pū ʻana me nā mea TPI i nā mahana kiʻekiʻe.

Ka laulā Ana:

Mānoanoa:9µm~35µm

Hana

He ʻeleʻele a ʻulaʻula paha ka ʻili o ka huahana, he haʻahaʻa ka ʻili.

Nā noi

ʻO ka Laminate Copper Clad Flexible (FCCL), Fine Circuit FPC, ʻiliʻili lahilahi kristal i uhi ʻia me ka LED.

Nā Hiʻohiʻona:

ʻO ke kiʻekiʻe o ka nui, ke kū'ē kūlou kiʻekiʻe a me ka hana etching maikaʻi.

ʻAno liʻiliʻi:

Nā Pepa Keleawe ED no FPC3

SEM (ʻAoʻao ʻino ma hope o ka mālama ʻana)

Nā Pepa Keleawe ED no FPC2

SEM (Ma mua o ka mālama ʻana i ka ʻili)

Nā Pepa Keleawe ED no FPC1

SEM (ʻAoʻao ʻĀlohilohi ma hope o ka mālama ʻana)

Papa 1- Hana (GB/T5230-2000、IPC-4562-2000):

Hoʻokaʻawale ʻana

ʻĀpana

9μm

12μm

18μm

35μm

ʻIke Cu

%

≥99.8

Kaumaha ʻĀpana

g/m2

80±3

107±3

153±5

283±7

Ikaika Hoʻopaʻa

RT (23℃)

Kg/mm2

≥28

HT (180℃)

≥15

≥15

≥15

≥18

Hoʻolōʻihi

RT (23℃)

%

≥5.0

≥5.0

≥6.0

≥10

HT (180℃)

≥6.0

≥6.0

≥8.0

≥8.0

ʻOʻoleʻa

ʻĀlohilohi (Ra)

μm

≤0.43

Matte(Rz)

≤2.5

Ikaika ʻili

RT (23℃)

Kg/cm

≥0.77

≥0.8

≥0.8

≥0.8

Ka helu hōʻemi o HCΦ (18%-1hr/25 ℃)

%

≤7.0

Hoʻololi o ke kala (E-1.0hr/200 ℃)

%

Maikaʻi loa

Ke lana nei ka Solder 290 ℃

Paukū.

≥20

ʻAno (Kahi a me ka pauka keleawe)

----

ʻAʻohe

Puʻu pine

EA

ʻole

Ka Hoʻomanawanui Nui

Ka laulā

mm

0~2mm

Ka lōʻihi

mm

----

ʻIwi

Mm/'īniha

Anawaena o loko 79mm/3 ʻīniha

Nānā: 1. Hiki ke kūkākūkā ʻia ka hana pale ʻana i ka oxidation o ka pepa keleawe a me ka helu kuhikuhi o ka ʻili.

2. Pili ka papa kuhikuhi hana i kā mākou ʻano hoʻāʻo.

3. ʻO ka manawa hōʻoia maikaʻi he 90 mau lā mai ka lā i loaʻa ai.


  • Ma mua:
  • Aʻe:

  • E kākau i kāu leka ma aneʻi a hoʻouna mai iā mākou