Ed copper bails no fpc
Huahana hou hoʻopuka
FCF, e maʻalahiCoper Fail ua hoʻomohalaʻia a hanaʻia no kaʻoihana FPC (FCCL). ʻOi aku ka maikaʻi o kēia FIPPLES CLIPL FPIT Folis,ʻoi aku ka maikaʻi o ka paʻakikīMAKAU NOIA Coper Fails. ^. I ka manawa like,ʻo ka pauʻana o ka lani a me ka maikaʻi o ka foloil folla aʻoi aku ka maikaʻi a me ke kū'ēʻanaEia pū pū kekahiʻoi aku ka maikaʻi ma mua o nā huahana copper fopper. Mai ke kauʻana o kēia mau keleawe keleawe i ke kaʻina hana electrollytic,ʻaʻole ia he Grease, kahi e maʻalahi ai ke hoʻohui pūʻia me nā kiʻekiʻe kiʻekiʻe.
AXMIONS:
MAKU:9}m~35μm
Hana
Heʻeleʻele aʻulaʻula paha ka mea huahana, he haʻahaʻa haʻahaʻa haʻahaʻa.
Noi
ʻO ka copper copper clad laminate
Nā hiʻohiʻona.
ʻO ke kiʻekiʻe kiʻekiʻe,ʻoi aku ke kiʻekiʻe o ke kū'ēʻana i ke kū'ē a me ka hana maikaʻiʻana.
Microstoructure:

Sem (ʻaoʻao paʻakikī ma hope o ka mālamaʻana)

Sem (ma mua o ka mālama kino)

Sem
Ka Hana Hana (GB / GB / T5230-2000, IPC-4562-2000):
Ka Heluhelu | Kōho | 9μm | 12μm | 18 μm | 35μm | |
Cuʻikepili | % | ≥99.8 | ||||
Wahi atari | g / m2 | 80 ± 3 | 107 ± 3 | 153 ± 5 | 283 ± 7 | |
Ikaika ikaika | Rt (23 ℃) | Kg / mm2 | ≥28 | |||
Ht (180 ℃) | ≥15 | ≥15 | ≥15 | ≥18 | ||
Ewangantion | Rt (23 ℃) | % | ≥5.0 | ≥5.0 | ≥6.0 | ≥10 |
Ht (180 ℃) | ≥6.0 | ≥6.0 | ≥8.0 | ≥8.0 | ||
Huahua | Shiny (ra) | }m | Ç0.43 | |||
Matte (rz) | ≤2.5 | |||||
Ikaika ikaika | Rt (23 ℃) | Kg / cm | ≥0.77 | ≥0.8 | ≥0.8 | ≥0.8 |
Degraded rate of hcφ (18% -1hr / 25 ℃) | % | ≤7.0 | ||||
Hoʻololi o ke kala (E-1.0hr / 200 ℃) | % | Maikaʻi loa | ||||
Reseder flip ago 290 ℃ | Sec. | ≥20 | ||||
Helehelena (wahi a me ke keleawe keleawe) | ---- | Nookahi | ||||
Kuikahi | EA | ʻole | ||||
ʻO ka hoʻohaʻahaʻa nui | Tion | mm | 0 ~ 2mm | |||
Lōʻihi | mm | ---- | ||||
Kuai | Mm / inch | I loko o ka conimeter 79mm / 3 Inch |
Kahakaha: 1. Hiki ke kūkāʻia nā hana pale coppidation collativation a me ka hoʻokaʻawaleʻana o ka density density index.
2. Ke kumuhana nei ka hana hana i kā mākouʻano hoʻokolohua.
3.ʻO ka manawa hōʻoia maikaʻi loa he 90 mau lā mai ka lā o ka loaʻa.