Nā Pepa Keleawe ED no FPC
Hoʻolauna Huahana
FCF, maʻalahipepa keleawe ua hoʻomohala kūikawā ʻia a hana ʻia no ka ʻoihana FPC (FCCL). ʻOi aku ka maikaʻi o ka ductility o kēia pepa keleawe electrolytic, haʻahaʻa ka roughness a ʻoi aku ka maikaʻi o ka ikaika peel ma mua okekahi pepa keleawesI ka manawa like, ʻoi aku ka maikaʻi o ka hoʻopau ʻana o ka ʻili a me ka maikaʻi o ka pepa keleawe a ʻoi aku ka pale ʻana o ka pelu ʻanapū kekahiʻoi aku ka maikaʻi ma mua o nā huahana pepa keleawe like. ʻOiai ua hoʻokumu ʻia kēia pepa keleawe ma ke kaʻina hana electrolytic, ʻaʻohe ona momona, kahi e maʻalahi ai ka hui pū ʻana me nā mea TPI i nā mahana kiʻekiʻe.
Ka laulā Ana:
Mānoanoa:9µm~35µm
Hana
He ʻeleʻele a ʻulaʻula paha ka ʻili o ka huahana, he haʻahaʻa ka ʻili.
Nā noi
ʻO ka Laminate Copper Clad Flexible (FCCL), Fine Circuit FPC, ʻiliʻili lahilahi kristal i uhi ʻia me ka LED.
Nā Hiʻohiʻona:
ʻO ke kiʻekiʻe o ka nui, ke kū'ē kūlou kiʻekiʻe a me ka hana etching maikaʻi.
ʻAno liʻiliʻi:
SEM (ʻAoʻao ʻino ma hope o ka mālama ʻana)
SEM (Ma mua o ka mālama ʻana i ka ʻili)
SEM (ʻAoʻao ʻĀlohilohi ma hope o ka mālama ʻana)
Papa 1- Hana (GB/T5230-2000、IPC-4562-2000):
| Hoʻokaʻawale ʻana | ʻĀpana | 9μm | 12μm | 18μm | 35μm | |
| ʻIke Cu | % | ≥99.8 | ||||
| Kaumaha ʻĀpana | g/m2 | 80±3 | 107±3 | 153±5 | 283±7 | |
| Ikaika Hoʻopaʻa | RT (23℃) | Kg/mm2 | ≥28 | |||
| HT (180℃) | ≥15 | ≥15 | ≥15 | ≥18 | ||
| Hoʻolōʻihi | RT (23℃) | % | ≥5.0 | ≥5.0 | ≥6.0 | ≥10 |
| HT (180℃) | ≥6.0 | ≥6.0 | ≥8.0 | ≥8.0 | ||
| ʻOʻoleʻa | ʻĀlohilohi (Ra) | μm | ≤0.43 | |||
| Matte(Rz) | ≤2.5 | |||||
| Ikaika ʻili | RT (23℃) | Kg/cm | ≥0.77 | ≥0.8 | ≥0.8 | ≥0.8 |
| Ka helu hōʻemi o HCΦ (18%-1hr/25 ℃) | % | ≤7.0 | ||||
| Hoʻololi o ke kala (E-1.0hr/200 ℃) | % | Maikaʻi loa | ||||
| Ke lana nei ka Solder 290 ℃ | Paukū. | ≥20 | ||||
| ʻAno (Kahi a me ka pauka keleawe) | ---- | ʻAʻohe | ||||
| Puʻu pine | EA | ʻole | ||||
| Ka Hoʻomanawanui Nui | Ka laulā | mm | 0~2mm | |||
| Ka lōʻihi | mm | ---- | ||||
| ʻIwi | Mm/'īniha | Anawaena o loko 79mm/3 ʻīniha | ||||
Nānā: 1. Hiki ke kūkākūkā ʻia ka hana pale ʻana i ka oxidation o ka pepa keleawe a me ka helu kuhikuhi o ka ʻili.
2. Pili ka papa kuhikuhi hana i kā mākou ʻano hoʻāʻo.
3. ʻO ka manawa hōʻoia maikaʻi he 90 mau lā mai ka lā i loaʻa ai.


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