Ed keleawe bulti

[HTE] High Evelongation Ed Copper Foil

HTE, wela a me ka ellingation copper foil i hanaʻia eNā'āpana civen

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[BCF]ʻO ka Pūnaeweleʻo CO Copper Foil

BCF, ka pā ʻO ka Copper Foil no nā batteries he mea kūʻai aku i kahi papa keleawe i kūkuluʻia a hanaʻia eNā'āpana civen kūikawā no ka hoʻohanaʻana i kaʻoihanaʻoihana lihim. This electrolytic copper foil has the advantages of high purity, low impurities, good surface finish, flat surface, uniform tension, and easy coating. With higher purity and better hydrophilic, the electrolytic copper foil for batteries can effectively increase the charge and discharge times and extend the cycle life of batteries. I ka manawa like,Nā'āpana civen

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[Vlp] haʻahaʻa haʻahaʻa haʻahaʻa ed copper foal

Vlp, huhū loalow profile fish copper fopper foil forNā'āpana civen hoʻohaʻahaʻa paʻakikī a me nā ikaika ikaika kiʻekiʻe. The copper foil produced by the electrolysis process has the advantages of high purity, low impurities, smooth surface, flat board shape, and large width. The electrolytic copper foil can be better laminated with other materials after roughening on one side, and it is not easy to peel off.

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[RTF] Hōʻalo i ka hana Copper foil

RTF, RkauāHanaʻiaʻO ka fopper copper fopoil he keleawe keleawe i kapaʻia i nā pae kiʻekiʻe i nā paeʻelua ma nāʻaoʻaoʻelua. This strengthens the peel strength of both sides of the copper foil, making it easier to use as an intermediate layer for bonding to other materials. Moreover, the different levels of treatment on both sides of the copper foil make it easier to etch the thinner side of the roughened layer. In the process of making a printed circuit board (PCB) panel, the treated side of the copper is applied to the dielectric material. The treated drum side is rougher than the other side, which constitutes a greater adhesion to the dielectric. This is the main advantage over standard electrolytic copper. The matte side does not require any mechanical or chemical treatment prior to the application of photoresist. It is already rough enough to have good laminating resist adhesion.

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Ed copper bails no fpc

FCF, e maʻalahiCoper Fail MAKAU NOIA Coper Fails. ^. I ka manawa like,ʻo ka pauʻana o ka lani a me ka maikaʻi o ka foloil folla aʻoi aku ka maikaʻi a me ke kū'ēʻanaEia pū pū kekahiʻoi aku ka maikaʻi ma mua o nā huahana copper fopper. Since this copper foil is based on the electrolytic process, it does not contain grease, which makes it easier to be combined with TPI materials at high temperatures.

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Paleʻia ed copper bouls

Std corcper copper foil i hanaʻia eNā'āpana civen

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ʻO nā bulti bultik copper birt

ʻO ka Ultra-Pront low-plays electrolytic copper foll i hanaʻia eNā'āpana civen aloha Aloha pwder. Hiki iā mākou ke hāʻawi i ka lawelaweʻo Sliling Soling e like me nā koi o nā mea kūʻai aku.

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