[HTE] Pepa keleawe ED Elongation kiʻekiʻe
![[HTE] Kiʻi i hōʻike ʻia no ka pepa kini keleawe ED Elongation kiʻekiʻe](https://cdn.globalso.com/civen-inc/HTE-High-Elongation-ED-Copper-Foil.png)
Hoʻolauna Huahana
HTE, wela kiʻekiʻe a me ka elongation pepa keleawe i hana ʻia eCIVEN METALHe kūpaʻa maikaʻi loa ia i nā mahana kiʻekiʻe a me ka ductility kiʻekiʻe. ʻAʻole oxidize a hoʻololi paha ke kala o ka pepa keleawe i nā mahana kiʻekiʻe, a ʻo kona ductility maikaʻi e maʻalahi ai ka laminate me nā mea ʻē aʻe. ʻO ka pepa keleawe i hana ʻia e ke kaʻina hana electrolysis he ʻili maʻemaʻe loa a me ke ʻano pepa pālahalaha. Hoʻopōʻino ʻia ka pepa keleawe ponoʻī ma kekahi ʻaoʻao, kahi e maʻalahi ai ka hoʻopili ʻana i nā mea ʻē aʻe. He kiʻekiʻe loa ka maʻemaʻe holoʻokoʻa o ka pepa keleawe, a he conductivity uila a me ka thermal maikaʻi loa. I mea e hoʻokō ai i nā pono o kā mākou mea kūʻai aku, hiki iā mākou ke hāʻawi ʻaʻole wale i nā ʻōwili o ka pepa keleawe, akā i nā lawelawe ʻokiʻoki maʻamau.
Nā kikoʻī
Mānoanoa: 1/4OZ~20OZ9µm~70µm)
Laulā: 550mm~1295mm
Hana
Loaʻa i ka huahana ka hana mālama mahana lumi maikaʻi loa, ka hana kūpaʻa oxidation wela kiʻekiʻe, ka maikaʻi o ka huahana e hoʻokō i ke kūlana IPC-4562ʻElua, Ⅲnā koi pae.
Nā noi
Kūpono no nā ʻano ʻōnaehana resin āpau o ka papa kaapuni paʻi ʻelua ʻaoʻao, multilayer
Nā Pōmaikaʻi
Hoʻohana ka huahana i kahi kaʻina hana mālama ʻili kūikawā e hoʻomaikaʻi i ka hiki o ka huahana ke pale aku i ka pala lalo a hōʻemi i ka pilikia o ke koena keleawe.
Hana (GB/T5230-2000, IPC-4562-2000)
| Hoʻokaʻawale ʻana | ʻĀpana | 1/4OZ (9μm) | 1/3OZ (12μm) | J OZ (15μm) | 1/2OZ (18μm) | 1 auneke (35μm) | 2OZ (70μm) | |
| ʻIke Cu | % | ≥99.8 | ||||||
| Kaumaha ʻĀpana | g/m2 | 80±3 | 107±3 | 127±4 | 153±5 | 283±5 | 585±10 | |
| Ikaika Hoʻopaʻa | RT (25℃) | Kg/mm2 | ≥28 | ≥30 | ||||
| HT (180℃) | ≥15 | |||||||
| Hoʻolōʻihi | RT (25℃) | % | ≥4.0 | ≥5.0 | ≥6.0 | ≥10 | ||
| HT (180℃) | ≥4.0 | ≥5.0 | ≥6.0 | |||||
| ʻOʻoleʻa | ʻĀlohilohi (Ra) | μm | ≤0.4 | |||||
| Matte(Rz) | ≤5.0 | ≤6.0 | ≤7.0 | ≤7.0 | ≤9.0 | ≤14 | ||
| Ikaika ʻili | RT (23℃) | Kg/cm | ≥1.0 | ≥1.2 | ≥1.2 | ≥1.3 | ≥1.8 | ≥2.0 |
| Ka helu hōʻemi o HCΦ (18%-1hr/25 ℃) | % | ≤5.0 | ||||||
| Hoʻololi o ke kala (E-1.0hr/190 ℃) | % | Maikaʻi loa | ||||||
| Ke lana nei ka Solder 290 ℃ | Paukū. | ≥20 | ||||||
| Puʻu pine | EA | ʻole | ||||||
| ʻO Preperg | ---- | FR-4 | ||||||
Hoʻomaopopo:1. ʻO ka waiwai Rz o ka ʻili nui o ka pepa keleawe ka waiwai paʻa hoʻāʻo, ʻaʻole kahi waiwai i hōʻoia ʻia.
2. ʻO ka ikaika o ka ʻili ka waiwai hoʻāʻo papa FR-4 maʻamau (5 mau ʻāpana o 7628PP).
3. ʻO ka manawa hōʻoia maikaʻi he 90 mau lā mai ka lā i loaʻa ai.
![[VLP] Pepa keleawe ED haʻahaʻa loa](https://cdn.globalso.com/civen-inc/VLP-Very-Low-Profile-ED-Copper-Foil-300x300.png)
![[RTF] Pepa keleawe ED i mālama ʻia ma hope](https://cdn.globalso.com/civen-inc/RTF-Reverse-Treated-ED-Copper-Foil-300x300.png)
![[BCF] Pila Keleawe ED Pākahi](https://cdn.globalso.com/civen-inc/BCF-Battery-ED-Copper-Foil1-300x300.png)
