[HTE] Kiekie Elongation ED Copper Foil
![[HTE] Kiʻi Hōʻike ʻia ʻo ED Copper Foil kiʻekiʻe](https://cdn.globalso.com/civen-inc/HTE-High-Elongation-ED-Copper-Foil.png)
Hoʻolauna Huahana
HTE, kiʻekiʻe wela a me ka elongation keleawe i hanaia eCIVEN METALhe kū'ē maikaʻi loa i nā wela kiʻekiʻe a me ka ductility kiʻekiʻe. ʻAʻole hoʻokahe a hoʻololi paha ke kala keleawe i nā wela kiʻekiʻe, a ʻo kona ductility maikaʻi e maʻalahi ke laminate me nā mea ʻē aʻe. ʻO ka pahu keleawe i hana ʻia e ke kaʻina electrolysis he ʻili maʻemaʻe loa a me kahi ʻano pepa pālahalaha. Hoʻopili ʻia ka pahu keleawe ma kekahi ʻaoʻao, kahi e maʻalahi ai ka hoʻopili ʻana i nā mea ʻē aʻe. ʻO ka maʻemaʻe holoʻokoʻa o ka foil keleawe he kiʻekiʻe loa, a he maikaʻi loa ka uila a me ka thermal conductivity. I mea e hoʻokō ai i nā pono o kā mākou mea kūʻai aku, hiki iā mākou ke hāʻawi i nā ʻōwili keleawe wale nō, akā i nā lawelawe slicing maʻamau.
Nā kikoʻī
Mānoanoa: 1/4OZ～20OZ(9µm～70µm)
Laulā: 550mm～1295mm
hana
Loaʻa i ka huahana ka maikaʻi o ka mālama ʻana i ka lumi wela o ka lumi, ke kiʻekiʻe kiʻekiʻe o ka oxidation pale ʻana, ka maikaʻi o ka huahana e hoʻokō i ka maʻamau IPC-4562Ⅱ, Ⅲkoi pae.
Nā noi
He kūpono no nā ʻano ʻōnaehana resin a pau o ka papa kaapuni paʻi ʻelua ʻaoʻao
Pono
Hoʻohana ka huahana i kahi kaʻina hana lapaʻau kūikawā kūikawā e hoʻomaikaʻi i ka hiki o ka huahana ke pale aku i ka corrosion lalo a hoʻemi i ka hopena o ke koena keleawe.
Hana (GB/T5230-2000, IPC-4562-2000)
| Hoʻokaʻawale | Unite | 1/4OZ (9μm) | 1/3OZ (12μm) | J OZ (15μm) | 1/2OZ (18μm) | 1OZ (35μm) | 2OZ (70μm) | |
| Cu Maʻiʻo | % | ≥99.8 | ||||||
| Kaumaha ʻāpana | g/m2 | 80±3 | 107±3 | 127±4 | 153±5 | 283±5 | 585±10 | |
| Ikaika U'i | RT(25 ℃) | Kg/mm2 | ≥28 | ≥30 | ||||
| HT(180 ℃) | ≥15 | |||||||
| ʻO ka elongation | RT(25 ℃) | % | ≥4.0 | ≥5.0 | ≥6.0 | ≥10 | ||
| HT(180 ℃) | ≥4.0 | ≥5.0 | ≥6.0 | |||||
| ʻoʻoleʻa | ʻālohilohi(Ra) | μm | ≤0.4 | |||||
| Māmā(Rz) | ≤5.0 | ≤6.0 | ≤7.0 | ≤7.0 | ≤9.0 | ≤14 | ||
| Ikaika Peel | RT(23 ℃) | Kg/cm | ≥1.0 | ≥1.2 | ≥1.2 | ≥1.3 | ≥1.8 | ≥2.0 |
| Hoʻohaʻahaʻa ʻia o HCΦ(18%-1hr/25 ℃) | % | ≤5.0 | ||||||
| Hoʻololi kala (E-1.0hr/190 ℃) | % | Maikaʻi loa | ||||||
| Kunai e lana ana 290 ℃ | Sec. | ≥20 | ||||||
| Pinhole | EA | ʻole | ||||||
| Preperg | ---- | FR-4 | ||||||
Nānā:1. ʻO ka waiwai Rz o ka ʻili nui o ka copper foil ka waiwai kūpaʻa hoʻāʻo, ʻaʻole ka waiwai i hoʻopaʻa ʻia.
2. ʻO ka ikaika Peel ka waiwai ho'āʻo papa FR-4 maʻamau (5 pepa o 7628PP).
3. ʻO ka manawa hōʻoia maikaʻi he 90 mau lā mai ka lā i loaʻa ai.
![[VLP] Haʻahaʻa Loa ED Copper Foil](https://cdn.globalso.com/civen-inc/VLP-Very-Low-Profile-ED-Copper-Foil-300x300.png)
![[RTF] Hoʻololi ʻia ʻo ED Copper Foil](https://cdn.globalso.com/civen-inc/RTF-Reverse-Treated-ED-Copper-Foil-300x300.png)
![[BCF] Bateri ED Copper Foil](https://cdn.globalso.com/civen-inc/BCF-Battery-ED-Copper-Foil1-300x300.png)