< img kiʻekiʻe = "1" laula = "1" style = "hōʻike:ʻaʻohe" src = "https://www.facebook.com/tr?id=1663378561090394&ev=PageView&noscript=1" /> ʻOi aku ka maikaʻi loa [RTF] Hoʻohuli ʻia ʻo ED Copper Foil Manufacturer and Factory | Civen

[RTF] Hoʻololi ʻia ʻo ED Copper Foil

ʻO ka wehewehe pōkole:

RTF, reverselapaʻau ʻiaelectrolytic copper foil he mea keleawe ia i hooleleia i na degere like ole ma na aoao elua. Hoʻoikaika kēia i ka ikaika peel o nā ʻaoʻao ʻelua o ka pahu keleawe, e maʻalahi ka hoʻohana ʻana ma ke ʻano he papa waena no ka hoʻopaʻa ʻana i nā mea ʻē aʻe. Eia kekahi, ʻo nā pae ʻokoʻa o ka lapaʻau ʻana ma nā ʻaoʻao ʻelua o ka pahu keleawe e maʻalahi ke kālai ʻana i ka ʻaoʻao ʻoi aku ka lahilahi o ka papa ʻākala. I ke kaʻina hana o ka papa kaapuni paʻi (PCB), ua hoʻohana ʻia ka ʻaoʻao i mālama ʻia o ke keleawe i ka mea dielectric. ʻOi aku ka ʻoi o ka ʻaoʻao pahu i mālama ʻia ma mua o ka ʻaoʻao ʻē aʻe, ʻo ia ka mea e hoʻopili nui ai i ka dielectric. ʻO kēia ka pono nui ma mua o ke keleawe electrolytic maʻamau. ʻAʻole pono ka ʻaoʻao matte i ka hana mechanical a i ʻole kemika ma mua o ka hoʻohana ʻana i ka photoresist. Ua 'o'ole'a lawa e loa'a ka laminating maika'i e kū'ē i ka adhesion.


Huahana Huahana

Huahana Huahana

Hoʻolauna Huahana

ʻO RTF, hoʻohuli ʻia i ka electrolytic copper foil, he ʻāpana keleawe i hoʻopaʻa ʻia i nā degere like ʻole ma nā ʻaoʻao ʻelua. Hoʻoikaika kēia i ka ikaika peel o nā ʻaoʻao ʻelua o ka pahu keleawe, e maʻalahi ka hoʻohana ʻana ma ke ʻano he papa waena no ka hoʻopaʻa ʻana i nā mea ʻē aʻe. Eia kekahi, ʻo nā pae ʻokoʻa o ka lapaʻau ʻana ma nā ʻaoʻao ʻelua o ka pahu keleawe e maʻalahi ke kālai ʻana i ka ʻaoʻao ʻoi aku ka lahilahi o ka papa ʻākala. I ke kaʻina hana o ka papa kaapuni paʻi (PCB), ua hoʻohana ʻia ka ʻaoʻao i mālama ʻia o ke keleawe i ka mea dielectric. ʻOi aku ka ʻoi o ka ʻaoʻao pahu i mālama ʻia ma mua o ka ʻaoʻao ʻē aʻe, ʻo ia ka mea e hoʻopili nui ai i ka dielectric. ʻO kēia ka pono nui ma mua o ke keleawe electrolytic maʻamau. ʻAʻole pono ka ʻaoʻao matte i ka hana mechanical a i ʻole kemika ma mua o ka hoʻohana ʻana i ka photoresist. Ua 'o'ole'a lawa e loa'a ka laminating maika'i e kū'ē i ka adhesion.

Nā kikoʻī

Hiki iā CIVEN ke hāʻawi i ka RTF electrolytic copper foil me ka mānoanoa nominal o 12 a 35µm a hiki i 1295mm laula.

hana

ʻO ka elongation wela kiʻekiʻe i hoʻohuli ʻia i mālama ʻia electrolytic copper foil i hoʻopaʻa ʻia i kahi kaʻina plating pololei e kāohi i ka nui o nā ʻōpū keleawe a puʻunaue like. Hiki i ka ʻili ʻālohilohi i hoʻohuli ʻia o ka ʻili keleawe ke hōʻemi nui i ka ʻawaʻawa o ka ʻōpala keleawe i kaomi pū ʻia a hāʻawi i ka ikaika peel lawa o ka ʻili keleawe. (E nana i ka Papa 1)

Nā noi

Hiki ke hoʻohana ʻia no nā huahana kiʻekiʻe a me nā laminates i loko, e like me nā kahua kahua 5G a me nā radar automotive a me nā mea hana ʻē aʻe.

Pono

ʻO ka ikaika paʻa maikaʻi, ka lamination multi-layer pololei, a me ka hana etching maikaʻi. Hoʻemi ia i ka hiki no ka pōkole pōkole a hoʻopōkole i ke kaʻina hana.

Papa 1. Hana

Hoʻokaʻawale

Unite

1/3OZ

(12μm)

1/2OZ

(18μm)

1OZ

(35μm)

Cu Maʻiʻo

%

min. 99.8

Kaumaha ʻāpana

g/m2

107±3

153±5

283±5

Ikaika U'i

RT(25 ℃)

Kg/mm2

min. 28.0

HT(180 ℃)

min. 15.0

min. 15.0

min. 18.0

ʻO ka elongation

RT(25 ℃)

%

min. 5.0

min. 6.0

min. 8.0

HT(180 ℃)

min. 6.0

ʻoʻoleʻa

ʻālohilohi(Ra)

μm

max. 0.6/4.0

max. 0.7/5.0

max. 0.8/6.0

Māmā(Rz)

max. 0.6/4.0

max. 0.7/5.0

max. 0.8/6.0

Ikaika Peel

RT(23 ℃)

Kg/cm

min. 1.1

min. 1.2

min. 1.5

Hoʻohaʻahaʻa ʻia o HCΦ(18%-1hr/25 ℃)

%

max. 5.0

Hoʻololi kala (E-1.0hr/190 ℃)

%

ʻAʻohe

Kunai e lana ana 290 ℃

Sec.

max. 20

Pinhole

EA

ʻole

Preperg

----

FR-4

Nānā:1. ʻO ka waiwai Rz o ka ʻili nui o ka copper foil ka waiwai kūpaʻa hoʻāʻo, ʻaʻole ka waiwai i hoʻopaʻa ʻia.

2. ʻO ka ikaika Peel ka waiwai ho'āʻo papa FR-4 maʻamau (5 pepa o 7628PP).

3. ʻO ka manawa hōʻoia maikaʻi he 90 mau lā mai ka lā i loaʻa ai.


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