[RTF] Hoʻololi ʻia ʻo ED Copper Foil
Hoʻolauna Huahana
ʻO RTF, hoʻohuli ʻia i ka electrolytic copper foil, he ʻāpana keleawe i hoʻopaʻa ʻia i nā degere like ʻole ma nā ʻaoʻao ʻelua. Hoʻoikaika kēia i ka ikaika peel o nā ʻaoʻao ʻelua o ka pahu keleawe, e maʻalahi ka hoʻohana ʻana ma ke ʻano he papa waena no ka hoʻopaʻa ʻana i nā mea ʻē aʻe. Eia kekahi, ʻo nā pae ʻokoʻa o ka lapaʻau ʻana ma nā ʻaoʻao ʻelua o ka pahu keleawe e maʻalahi ke kālai ʻana i ka ʻaoʻao ʻoi aku ka lahilahi o ka papa ʻākala. I ke kaʻina hana o ka papa kaapuni paʻi (PCB), ua hoʻohana ʻia ka ʻaoʻao i mālama ʻia o ke keleawe i ka mea dielectric. ʻOi aku ka ʻoi o ka ʻaoʻao pahu i mālama ʻia ma mua o ka ʻaoʻao ʻē aʻe, ʻo ia ka mea e hoʻopili nui ai i ka dielectric. ʻO kēia ka pono nui ma mua o ke keleawe electrolytic maʻamau. ʻAʻole pono ka ʻaoʻao matte i ka hana mechanical a i ʻole kemika ma mua o ka hoʻohana ʻana i ka photoresist. Ua 'o'ole'a lawa e loa'a ka laminating maika'i e kū'ē i ka adhesion.
Nā kikoʻī
Hiki iā CIVEN ke hāʻawi i ka RTF electrolytic copper foil me ka mānoanoa nominal o 12 a 35µm a hiki i 1295mm laula.
hana
ʻO ka elongation wela kiʻekiʻe i hoʻohuli ʻia i mālama ʻia electrolytic copper foil i hoʻopaʻa ʻia i kahi kaʻina plating pololei e kāohi i ka nui o nā ʻōpū keleawe a puʻunaue like. Hiki i ka ʻili ʻālohilohi i hoʻohuli ʻia o ka ʻili keleawe ke hōʻemi nui i ka ʻawaʻawa o ka ʻōpala keleawe i kaomi pū ʻia a hāʻawi i ka ikaika peel lawa o ka ʻili keleawe. (E nana i ka Papa 1)
Nā noi
Hiki ke hoʻohana ʻia no nā huahana kiʻekiʻe a me nā laminates i loko, e like me nā kahua kahua 5G a me nā radar automotive a me nā mea hana ʻē aʻe.
Pono
ʻO ka ikaika paʻa maikaʻi, ka lamination multi-layer pololei, a me ka hana etching maikaʻi. Hoʻemi ia i ka hiki no ka pōkole pōkole a hoʻopōkole i ke kaʻina hana.
Papa 1. Hana
Hoʻokaʻawale | Unite | 1/3OZ (12μm) | 1/2OZ (18μm) | 1OZ (35μm) | |
Cu Maʻiʻo | % | min. 99.8 | |||
Kaumaha ʻāpana | g/m2 | 107±3 | 153±5 | 283±5 | |
Ikaika U'i | RT(25 ℃) | Kg/mm2 | min. 28.0 | ||
HT(180 ℃) | min. 15.0 | min. 15.0 | min. 18.0 | ||
ʻO ka elongation | RT(25 ℃) | % | min. 5.0 | min. 6.0 | min. 8.0 |
HT(180 ℃) | min. 6.0 | ||||
ʻoʻoleʻa | ʻālohilohi(Ra) | μm | max. 0.6/4.0 | max. 0.7/5.0 | max. 0.8/6.0 |
Māmā(Rz) | max. 0.6/4.0 | max. 0.7/5.0 | max. 0.8/6.0 | ||
Ikaika Peel | RT(23 ℃) | Kg/cm | min. 1.1 | min. 1.2 | min. 1.5 |
Hoʻohaʻahaʻa ʻia o HCΦ(18%-1hr/25 ℃) | % | max. 5.0 | |||
Hoʻololi kala (E-1.0hr/190 ℃) | % | ʻAʻohe | |||
Kunai e lana ana 290 ℃ | Sec. | max. 20 | |||
Pinhole | EA | ʻole | |||
Preperg | ---- | FR-4 |
Nānā:1. ʻO ka waiwai Rz o ka ʻili nui o ka copper foil ka waiwai kūpaʻa hoʻāʻo, ʻaʻole ka waiwai i hoʻopaʻa ʻia.
2. ʻO ka ikaika Peel ka waiwai ho'āʻo papa FR-4 maʻamau (5 pepa o 7628PP).
3. ʻO ka manawa hōʻoia maikaʻi he 90 mau lā mai ka lā i loaʻa ai.