[RTF] Pepa keleawe ED i mālama ʻia ma hope
Hoʻolauna Huahana
ʻO RTF, ka pepa keleawe electrolytic i hoʻoponopono hou ʻia he pepa keleawe i hoʻopōʻino ʻia i nā kekelē like ʻole ma nā ʻaoʻao ʻelua. Hoʻoikaika kēia i ka ikaika o ka ʻili o nā ʻaoʻao ʻelua o ka pepa keleawe, e maʻalahi ai ka hoʻohana ʻana ma ke ʻano he papa waena no ka hoʻopili ʻana i nā mea ʻē aʻe. Eia kekahi, ʻo nā pae like ʻole o ka mālama ʻana ma nā ʻaoʻao ʻelua o ka pepa keleawe e maʻalahi ai ke kahakaha ʻana i ka ʻaoʻao lahilahi o ka papa i hoʻopōʻino ʻia. I ke kaʻina hana o ka hana ʻana i kahi panela papa kaapuni paʻi (PCB), ua hoʻopili ʻia ka ʻaoʻao i mālama ʻia o ke keleawe i ka mea dielectric. ʻOi aku ka ʻino o ka ʻaoʻao pahu i mālama ʻia ma mua o kekahi ʻaoʻao, ʻo ia ka mea e hoʻopili nui ai i ka dielectric. ʻO kēia ka pono nui ma mua o ke keleawe electrolytic maʻamau. ʻAʻole pono ka ʻaoʻao matte i kekahi mālama mechanical a kemika paha ma mua o ka hoʻopili ʻana o ka photoresist. Ua lawa ka ʻino e loaʻa ai ka hoʻopili laminating resist maikaʻi.
Nā kikoʻī
Hiki iā CIVEN ke hoʻolako i ka pepa keleawe electrolytic RTF me ka mānoanoa maʻamau o 12 a 35µm a hiki i ka laulā 1295mm.
Hana
Hoʻopili ʻia ka foil keleawe electrolytic i hoʻohuli ʻia i ka mahana kiʻekiʻe i kahi kaʻina hana plating kikoʻī e kāohi i ka nui o nā ʻōpū keleawe a hoʻolaha like iā lākou. Hiki i ka ʻili ʻālohilohi i hoʻohuli ʻia o ka foil keleawe ke hōʻemi nui i ka ʻoʻoleʻa o ka foil keleawe i paʻi pū ʻia a hāʻawi i ka ikaika ʻili kūpono o ka foil keleawe. (E nānā i ka Papa 1)
Nā noi
Hiki ke hoʻohana ʻia no nā huahana alapine kiʻekiʻe a me nā laminates o loko, e like me nā kikowaena kumu 5G a me ka radar kaʻa a me nā lako ʻē aʻe.
Nā Pōmaikaʻi
ʻO ka ikaika hoʻopaʻa maikaʻi, ka lamination multi-layer pololei, a me ka hana etching maikaʻi. Hoʻemi pū ia i ka hiki ke kaapuni pōkole a hoʻopōkole i ka manawa pōʻaiapuni hana.
Papa 1. Hana
| Hoʻokaʻawale ʻana | ʻĀpana | 1/3OZ (12μm) | 1/2OZ (18μm) | 1 auneke (35μm) | |
| ʻIke Cu | % | palena iki 99.8 | |||
| Kaumaha ʻĀpana | g/m2 | 107±3 | 153±5 | 283±5 | |
| Ikaika Hoʻopaʻa | RT (25℃) | Kg/mm2 | palena iki 28.0 | ||
| HT (180℃) | palena iki he 15.0 | palena iki he 15.0 | palena iki 18.0 | ||
| Hoʻolōʻihi | RT (25℃) | % | palena iki 5.0 | palena iki 6.0 | palena iki 8.0 |
| HT (180℃) | palena iki 6.0 | ||||
| ʻOʻoleʻa | ʻĀlohilohi (Ra) | μm | ʻoi loa 0.6/4.0 | ʻoi loa 0.7/5.0 | ʻoi loa 0.8/6.0 |
| Matte(Rz) | ʻoi loa 0.6/4.0 | ʻoi loa 0.7/5.0 | ʻoi loa 0.8/6.0 | ||
| Ikaika ʻili | RT (23℃) | Kg/cm | 1.1 minuke | 1.2 minuke | 1.5 minuke |
| Ka helu hōʻemi o HCΦ (18%-1hr/25 ℃) | % | ʻoi aku ma mua o 5.0 | |||
| Hoʻololi o ke kala (E-1.0hr/190 ℃) | % | ʻAʻohe | |||
| Ke lana nei ka Solder 290 ℃ | Paukū. | ʻoi aku ma mua o 20 | |||
| Puʻu pine | EA | ʻole | |||
| ʻO Preperg | ---- | FR-4 | |||
Hoʻomaopopo:1. ʻO ka waiwai Rz o ka ʻili nui o ka pepa keleawe ka waiwai paʻa hoʻāʻo, ʻaʻole kahi waiwai i hōʻoia ʻia.
2. ʻO ka ikaika o ka ʻili ka waiwai hoʻāʻo papa FR-4 maʻamau (5 mau ʻāpana o 7628PP).
3. ʻO ka manawa hōʻoia maikaʻi he 90 mau lā mai ka lā i loaʻa ai.
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