[VLP] Haʻahaʻa Loa ED Copper Foil
![[VLP] Kiʻi Hōʻike ʻia ʻo ED Copper Foil](https://cdn.globalso.com/civen-inc/VLP-Very-Low-Profile-ED-Copper-Foil.png)
Hoʻolauna Huahana
ʻO VLP, haʻahaʻa haʻahaʻa electrolytic copper foil i hana ʻia e CIVEN METAL nā hiʻohiʻona o ka haʻahaʻa haʻahaʻa a me ka ikaika peel kiʻekiʻe. ʻO ka pahu keleawe i hana ʻia e ke kaʻina electrolysis nā mea maikaʻi o ka maʻemaʻe kiʻekiʻe, nā haumia haʻahaʻa, ka ʻili maʻemaʻe, ke ʻano o ka papa pālahalaha, a me ka laulā nui. Hiki ke hoʻopili maikaʻi ʻia ka foil keleawe electrolytic me nā mea ʻē aʻe ma hope o ka paʻakikī ʻana ma kekahi ʻaoʻao, a ʻaʻole maʻalahi ke ʻili.
Nā kikoʻī
Hiki iā CIVEN ke hāʻawi i ka ultra-low profile high temperature ductile electrolytic copper foil (VLP) mai 1/4oz a i 3oz (nominal mānoanoa 9μm a 105μm), a ʻo ka nui o ka huahana he 1295mm x 1295mm sheet copper foil.
hana
CIVEN hāʻawi i ka ultra-thick electrolytic copper foil me nā waiwai kino maikaʻi o ka equiaxial fine crystal, haʻahaʻa haʻahaʻa, ikaika kiʻekiʻe a me ka elongation kiʻekiʻe. (E nana i ka Papa 1)
Nā noi
E pili ana i ka hana ʻana i nā papa kaapuni mana kiʻekiʻe a me nā papa kiʻekiʻe no ka automotive, uila uila, kamaʻilio, pūʻali koa a me ka aerospace.
Nā hiʻohiʻona
Hoʻohālikelike me nā huahana like ʻole.
1. The grain structure of our VLP electrolytic copper foil is equiaxed fine crystal spherical; ʻoiai he kolamu a lōʻihi ke ʻano o nā huahana like ʻole.
2. Electrolytic copper foil he ultra-low profile, 3oz copper foil gross surface Rz ≤ 3.5µm; ʻoiai ʻo nā huahana like ʻole he ʻano maʻamau, 3oz copper foil gross surface Rz > 3.5µm.
Pono
1. No ka mea he ultra-haʻahaʻa kā mākou huahana, hoʻoponopono ia i ka pilikia o ka laina pōkole ma muli o ka ʻōpala nui o ka pahu keleawe mānoanoa maʻamau a me ka maʻalahi o ke komo ʻana o ka pepa insulation lahilahi e ka "niho wolf" i ka wā e kaomi ai i ka. panel ʻaoʻao ʻelua.
2. No ka mea, ua hoʻohālikelike ʻia ke ʻano o ka palaoa o kā mākou huahana i ka spherical aniani maikaʻi, e hoʻopōkole i ka manawa o ka etching laina a hoʻomaikaʻi i ka pilikia o ka etching ʻaoʻao laina ʻole.
3, ʻoiai ke loaʻa nei ka ikaika peel kiʻekiʻe, ʻaʻohe hoʻoili keleawe pauka, nā kiʻi kiʻi kiʻi PCB hana hana.
Hana (GB/T5230-2000, IPC-4562-2000)
| Hoʻokaʻawale | Unite | 9μm | 12μm | 18μm | 35μm | 70μm | 105μm | |
| Cu Maʻiʻo | % | ≥99.8 | ||||||
| Kaumaha ʻāpana | g/m2 | 80±3 | 107±3 | 153±5 | 283±7 | 585±10 | 875±15 | |
| Ikaika U'i | RT(23 ℃) | Kg/mm2 | ≥28 | |||||
| HT(180 ℃) | ≥15 | ≥18 | ≥20 | |||||
| ʻO ka lōʻihi | RT(23 ℃) | % | ≥5.0 | ≥6.0 | ≥10 | |||
| HT(180 ℃) | ≥6.0 | ≥8.0 | ||||||
| ʻoʻoleʻa | ʻālohilohi(Ra) | μm | ≤0.43 | |||||
| Māmā(Rz) | ≤3.5 | |||||||
| Ikaika Peel | RT(23 ℃) | Kg/cm | ≥0.77 | ≥0.8 | ≥0.9 | ≥1.0 | ≥1.5 | ≥2.0 |
| Hoʻohaʻahaʻa ʻia o HCΦ(18%-1hr/25 ℃) | % | ≤7.0 | ||||||
| Hoʻololi kala (E-1.0hr/200 ℃) | % | Maikaʻi loa | ||||||
| Kunai e lana ana 290 ℃ | Sec. | ≥20 | ||||||
| ʻO ke ʻano (Spot and copper powder) | ---- | ʻAʻohe | ||||||
| Pinhole | EA | ʻole | ||||||
| Ka hoʻomanawanui ʻana | Laulā | mm | 0~2mm | |||||
| Ka lōʻihi | mm | ---- | ||||||
| Core | Mm/inihi | Aia loko 79mm/3 iniha | ||||||
Nānā:1. ʻO ka waiwai Rz o ka ʻili nui o ka copper foil ka waiwai kūpaʻa hoʻāʻo, ʻaʻole ka waiwai i hoʻopaʻa ʻia.
2. ʻO ka ikaika Peel ka waiwai ho'āʻo papa FR-4 maʻamau (5 pepa o 7628PP).
3. ʻO ka manawa hōʻoia maikaʻi he 90 mau lā mai ka lā i loaʻa ai.
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